Electronics Forum | Mon Apr 22 20:55:00 EDT 2002 | ianchan
Hi, this is not really a technical solution, just a feedback. we too have a model series using the same WS paste type. it gives a dull solder joint with white residue that can be marginally removed after post-DI water rinse (ie. not 100% removed).
Electronics Forum | Tue Jun 07 08:31:57 EDT 2011 | bootstrap
I am building a rugged digital video camera product that essentially is just a sandwitch of 3 parts: #1: front piece is machined aluminum with C-mount thread #2: middle piece is 1/16" printed circuit board #3: back piece is machined aluminum The
Electronics Forum | Thu May 04 05:04:04 EDT 2000 | Richard Durrant
I have a few lcc devices that have large metal areas on their bases that require them to be soldered to the board for thermal and electrical reasons. I have provided a large copper pad and thermal vias, but how do I describe the solder stencil inform
Electronics Forum | Thu Sep 16 17:22:16 EDT 1999 | DaveJ
We have some SMT components with gold plated leads. They're actually LCC led packages. A good solder alloy to use would be Indium / Lead to reduce tin dissolution into the gold and avoid the resultant brittle intermetallic compound. However, a recomm
Electronics Forum | Wed Mar 20 00:55:01 EST 2002 | ianchan
Heyz...at this rate i'am losing my mind too! We have been doing the "looks good; look bad" approach, and backed it all up with Z-height paste measurements. Only thing there's this customer QA asking how we established those USL & LSL utilized in our
Electronics Forum | Mon Nov 06 11:00:58 EST 2006 | SteveH
What low profile components are you dealing with? We have had problems with cleaning under leadless chip carriers using an aquastorm 200 with Kyzen Aquanox 4520T and the general concensus is that you will not clean under this type of device with an
Electronics Forum | Tue Nov 07 09:25:36 EST 2006 | pjc
Can be done with AquaStorm 200, with some mods. I worked on a project a few years ago for a military company that needed to clean no-clean solderpaste residues from under LCC devices, we're talking like 2mil standoff. We ended up using a Zestron clea
Electronics Forum | Fri Aug 26 19:59:02 EDT 2016 | mhanrahan
We've just purchased a CP45FV Neo to replace an ancient Panasonic line. First non-Panasonic placement equipment I've worked on, so learning as I go here. So far it's been pretty straightforward. However, we use some parts that come in QFN or LCC p
Electronics Forum | Sat Dec 16 10:03:32 EST 2000 | Dave F
Castellation. A recessed metalized feature on the edge of a leadless chip carrier [LCC] that is used to interconnect conducting surface or planes within or on the chip carrier. If you search the fine SMTnet Archives, you find: * A fine thread [cast
Electronics Forum | Thu Sep 16 18:07:16 EDT 1999 | Earl Moon
| We have some SMT components with gold plated leads. They're actually LCC led packages. A good solder alloy to use would be Indium / Lead to reduce tin dissolution into the gold and avoid the resultant brittle intermetallic compound. However, a reco
