Industry News | 2019-01-08 20:43:11.0
Nordson ASYMTEK will be demonstrating large-volume and advanced dispensing, hot bar soldering, and a conformal coating line at IPC APEX, San Diego, CA from January 29-31, 2019, at booth 2125.Also featured will be a range of jets and valves for dispensing and coating applications, including the award-winning SC-350 Select Spray Applicator.
Industry News | 2016-04-26 11:11:11.0
Gen3 Systems Limited, a specialist British manufacturer and distributor, sees a significant increase in demand for its redesigned line of Surface Insulation Resistance Testers (AutoSIR) and Conductive Anodic Filament Monitoring Testing System (AutoCAF).
Industry News | 2022-04-11 21:59:08.0
Tom Baro will be on-site to discuss how Hentec/RPS selective soldering, lead tinning and solderability test equipment can improve your production quality.
Industry News | 2011-02-14 14:35:18.0
Christopher Associates/Koki Solder announces that Jasbir Bath, Consulting Engineer, will give a presentation about Head-in-Pillow Component Soldering Defects at the upcoming LA/O.C. SMTA Chapter Dinner, scheduled to take place Thursday, February 17, 2011 at JT Schmid’s Restaurant & Brewery in Anaheim, CA at 7 p.m.
Industry News | 2013-11-05 10:04:10.0
Marquardt GmbH of Rietheim-Weilheim (Germany)uses the Viscom S3088 SPI3D solder paste inspection system.
Industry News | 2011-08-24 14:41:54.0
Kyzen announces that Dr. Mike Bixenman will teach a Professional Development Course on the IPC-CH-65B Guidelines for Cleaning of Printed Boards and Assemblies at the upcoming IPC Midwest Conference & Exhibition, scheduled to take place September 21-22, 2011 at the Renaissance Schaumburg Hotel and Convention Center in Schaumburg, IL.
Industry News | 2019-04-10 10:19:18.0
(Albany, NY) April 8, 2019 IMAPS New England Symposium & Expo 2019, will be held at the Boxboro Regency Hotel & Conference Center, in Boxborough, MA on May 7, 2019. YINCAE Advanced Materials hopes you will stop by our booth to learn more about YINCAE and the innovative products we have to offer: Solder Joint Encapsulants, Underfill Materials, Die Attach Adhesives, Thermal Interface Materials and more.
Industry News | 2022-04-28 14:30:28.0
Koh Young Technology, the industry leader in True 3D measurement-based inspection solutions, will highlight an array of award-winning inspection and measurement solutions at SMTconnnect in booth 4.A-233 on the NürnbergMesse event grounds during 10-12 May 2022. The following is just a glimpse into what Koh Young will have in store for our visitors at the tradeshow:
Industry News | 2023-10-31 18:47:22.0
Koh Young will highlight live demonstrations of its award-winning inspection and measurement solutions for printed circuit board, advanced packaging, and semiconductor assembly at Productronica, the highly-anticipated trade fair in Messe München on November 14-17, 2023 in Munich, Germany. Koh Young will have two booths. The first is at A2.377 and is focused on traditional surface mount technology. Our sister booth at A2.359 is focused on advanced packaging and semiconductor inspection innovations. Join our booth at Productronica 2023 to find out more. The following is just a glimpse into what Koh Young will have in store for our visitors.
Technical Library | 2022-12-19 18:59:51.0
Material and Process Characterization studies can be used to quantify the harmful effects that might arise from solder flux and other process residues left on external surfaces after soldering. Residues present on an electronic assembly can cause unwanted electrochemical reactions leading to intermittent performance and total failure. Components with terminations that extend underneath the package can trap flux residue. These bottom terminated components are flush with the bottom of the device and can have small solderable terminations located along the perimeter sides of the package. The clearance between power and ground render high electrical forces, which can propagate electrochemical interactions when exposed to atmospheric moisture (harsh environments). The purpose of this research is to predict and understand the functional performance of residues present under single row QFN component packages. The objective of the research study is to develop and collect a set of guidelines for understanding the relationship between ionic contamination and electrical performance of a BTC component when exposed to atmospheric moisture and the trade-offs between electrical, ionic contamination levels, and cleanliness. Utilizing the knowledge gained from undertaking the testing of QFN components and associated DOE, the team will establish a reference Test Suite and Test Spec for cleanliness.
COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.
2481 Hilton Drive
Gainesville, GA USA
Phone: (770) 538-0411
