Electronics Forum | Fri Aug 04 08:28:20 EDT 2006 | Rob
Hi Joe, Try: S03X7C-56M from koki - http://www.ko-ki.co.jp which has cobalt in it to extend tip life or: SN100C from Nihon Superior, which is a nickel stabilised alloy that also extends tip life. The Koki solder flows better that any other leadfr
Electronics Forum | Thu Jan 19 21:43:33 EST 2006 | davef
Specifically, what element of the bare board is blistering? Tg of 140 could be acceptable. Search the fine SMTnet Archives for background on decomposition temperature [td]
Electronics Forum | Fri Jan 20 13:25:07 EST 2006 | Gary Kemp
The mask/copper layer is exhibiting popcorn blistering following reflow. With profiling we know that the assembly does not see anything close to 250 C, rather around 238 C.
Electronics Forum | Fri Jul 06 12:11:34 EDT 2007 | james
We are starting to see issues with using Kester WS R562 with lead free components. The joints look grainy on almost all of the 0402'2 and other small components. Some of the solder does not solder to the terminations. These are hybrid boards which
Electronics Forum | Thu Jan 19 20:40:52 EST 2006 | Gary Kemp
We are experiencing a blistering problem during our process of lead free assembly. The customer has supplied us with the bare fab rated at 140 Tg. I am under the assumption that the Tg rating should at minimum be 170. Does anyone know if there is
Electronics Forum | Mon Sep 17 05:06:04 EDT 2012 | benreben
Hi, maybe solderability of PCB...
Electronics Forum | Wed Sep 19 10:38:58 EDT 2012 | mark25y2001
It's both solderpaste or PCB pad problem... 1st it's possible that your PCB exposure problem or old stocks, remedy? try to bake your PWB. 2nd, it's possible that PWB coating (wax) are more ticked so that solder paste flux are cannot penetrate to clea
Electronics Forum | Thu Mar 20 09:01:33 EDT 2008 | meritajs
Thanks Greg Our main problem is that we are putting small number PCB through, about300 PCB, size180*250. Such number order our customer in week. In result we got such high solder consumption and high production cost. We will tray to use antiacidant.
Electronics Forum | Mon Dec 20 08:23:30 EST 2010 | johanhuizing
The buyers in our company like to change the PCB finishing because of reducing costs. The proposed change is going from Ni/Au to HASL lead free, I know that in the beginning of the lead free period there where a lot of problems to use the HASL especi
Electronics Forum | Tue Sep 11 22:40:26 EDT 2007 | philip_yam
We are testing SAC paste for thru-hole components in the 2nd reflow process. The solder joint is alright but some problem encountered in FR1 or CAM2 PCB after multiple times of reflow due to the temperature. We are very interested in Zn or Bi-based l
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