Electronics Forum | Thu Oct 18 11:08:22 EDT 2012 | scottp
Since we follow IPC Class III, I've done experiments turning N2 on and off and measuring void level with both SnPb and SAC305 solder. In both cases there was a statistically significant, measurable increase in voids with N2, but it wasn't significan
Electronics Forum | Thu Nov 17 08:57:39 EST 2005 | russ
No clean and foam fluxing is not a very good process from my experience. I know that the flux manufacturers claim that they are suitable but I am not sure what "suitable" means. I would bet that you have very inconsistant flux coverage. How often
Electronics Forum | Thu Sep 23 08:47:25 EDT 2021 | majdi4
1)Though in many cases the difference between SAC305 and SAC405 was small,and not always statistically significant, it was observed that SAC405 generally outperformed SAC305 joints. Under 0°C to 100°C thermal cycling,no statistically significant
Electronics Forum | Tue Sep 18 11:34:36 EDT 2001 | jschake
The tightest spacing between neighboring 0201 components assembled was 8-mils. Please refer to the response for the query entitled �Minimizing Tombstoning Defects� posted by martys, as the response provided there is also relevant to address this que
Electronics Forum | Thu Nov 17 20:51:16 EST 2005 | cangly
Morning Mike, We use Pb63/Sn37, Alpha Metal alloy. Solder pot is at 250 C. The profile of board after Preheat about 100 C, Lambda Wave about 220C (use both Lambda and Chip wave), DWell time 2.1s ~ 3s. Conveyor speed 1.5 in/min. We run by bare board a
Electronics Forum | Thu Nov 17 21:46:48 EST 2005 | C. Kolokoy
With DIP type components, a sub-par fluxing method (foaming a no-clean), and a chip wave where one is not needed are formulas for bridging and insufficient wetting. If you have SMD's on the wave solder side of the board greater than 0603, and no SOT
Electronics Forum | Sat Jan 10 09:04:47 EST 2015 | jandon
class 3 requires 100% barrel fill Class 3 requires 75% vertical fill of solder for component with less or more than 14 leads. Not 100% fill.
Electronics Forum | Thu May 29 17:48:00 EDT 2003 | jonfox
As far as I know, the limitations apply to to the manufacturing components, not the equipment per say. At this point there is no set date for the US at the national level. Basically our government is run by big businesses and their effect on our na
Electronics Forum | Wed May 25 23:45:04 EDT 2022 | SMTA-64387687
1. The jetting head flies very low to the level of the board. So, performing AOI function will crash the head. 2. AOI is performed close to the end of the line, after P&P or reflow. Are you planning to run the boards back-and-forth, on the line? 3. L
Electronics Forum | Mon Oct 29 20:19:44 EST 2001 | davef
DON'T do it!!! The two problems you'll have are: 1 Poor manufacturing process control, resulting in weak solder connections. 2 Weak solder connections are stressed, when the board is straightened upon installation in the "box". There's several hits
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