Electronics Forum | Fri Nov 30 00:51:10 EST 2007 | vinitverma
Here are the differences (Eclipse vs Eclipse II) Optimum Speed: 5000 vs 6500cph Feeder Positions (8mm) : 80 vs 94 PCB Loading Time : 4s vs 5.3s PCB Thickness : 0.6-3mm vs 0.5-4mm Max Component Size : 32mm vs 45mm (optional camera possible on Eclipse
Electronics Forum | Fri Sep 08 21:49:24 EDT 2017 | sbar5781
Hello, I have a few PCB boards i am trying to be manufactured that are miniaturized medical devices. Thus they require IPC Class 3 Specs. However as miniature devices they have limited space, including a 0.4mm pitch BGA socket, which currently has
Electronics Forum | Mon May 16 15:29:53 EDT 2005 | jdumont
We have the exact same issue with out 456 ball Xilinx parts. The corner balls either do not touch or are so stretched out that they are intermittant. I believe this to be a moisture ingress problem. Ive been setting up our little batch oven this afte
Electronics Forum | Tue Jan 12 15:04:40 EST 1999 | Earl Moon
| I have used conductive adhesives for some time now on thickfilm. Does anyone know of a really good conductive adhesive to attach flip chips to flex circuits? I would like to stencil print the adhesive to the substrate and then place the flips chi
Electronics Forum | Thu Sep 11 10:01:30 EDT 2014 | spoiltforchoice
1 - Too messy, parts already come in nice easy to use machine compatible packaging, tapes, reels, tubes and trays. All you are doing is adding an extra step and complication. A key production aim is to reduce the number of steps. 2 - BGA - a chip wi
