New SMT Equipment: mid-chip solder balling (Page 3 of 13)

Soldering materials and fluxes

Soldering materials and fluxes

New Equipment | Solder Materials

Soldering materials: Soldering wires Soldering pastes Stencils Soldering shots Soldering balls Fluxes Rosin liquid and gel fluxes Fluxes residues do not cause corrosion http://www.selen.hr/pokaz_kategorie.php?cid=9

Selen d.o.o.

NC No-Clean Tacky/Rework Solder Paste Flux

NC No-Clean Tacky/Rework Solder Paste Flux

New Equipment | Solder Materials

NC Paste Flux is a no clean tacky/rework flux designed to wet virtually all solderable electronic surfaces, components, assemblies, and substrates. AIM NC Paste Flux may be used for general touch up or rework of printed circuit boards, and for attach

AIM Solder

BGA Rework & Micro BGA Rework Stencils

New Equipment |  

Stencils, metal mask tools used for the deposit of solder paste or preformed solder balls onto BGA substrate. Please call for the best process for your requirements.

I-Source Technical Services, Inc.

SBK-CHIPRP-KIT Solder Ball Placement Kit

SBK-CHIPRP-KIT Solder Ball Placement Kit

New Equipment | Rework & Repair Equipment

Reworking small chip components like 01005, 0201, 0402, & 0602s are difficult and require specialized tools. Metcal has developed a technique and identified a selection of tools that enable the operator to rework these small components with repeatab

Metcal

BGA ReBalling System

BGA ReBalling System

New Equipment |  

Don't throw your BGA's away, re-ball them with the Waveroom Plus Reballing system. This is a very user friendly system that is being used extensively by Contract Assembly houses. There are other systems, most much more expensive than this. None work

Waveroom Plus

Easy re=place - Bga Rework machines

Easy re=place - Bga Rework machines

New Equipment |  

Ball grid array placement and soldering The Etneo "easy re=place" is a system for the easy placement and soldering of any SMT components. The system has an exclusive and unique solution to easy and quickly determine the correct soldering profile

Etneo Italia spa

SMT 256  Solder Joint Encapsulant

SMT 256 Solder Joint Encapsulant

New Equipment | Materials

World's First Solder Joint Encapsulant Perfect solution for customers looking to eliminate underfilling processes. The SMT 256 Individual Solder Joint Encapsulation Adhesive is the world’s first combined flux gel/individual solder joint encapsulati

YINCAE Advanced Materials, LLC.

ChipFlo

New Equipment |  

Low Velocity Nitrogen Convection for BGA Solder Ball Attachment and Semiconductor Backend Assembly

Research International

SMT Solutions

New Equipment |  

We are a Re-balling company based in Chihuahua, Chihuahua.Our core business is the Salvage and Recovery of Electronic Components.Also we offer technical consulting and training in SMT and Wave Soldering.

SMT Solutions

IR2015 IR Infrared BGA Rework System

IR2015 IR Infrared BGA Rework System

New Equipment | Rework & Repair Equipment

IR2015 Infrared reflow soldering section of BGA rework system Infrared temperature sensor monitors BGA surface temperature directly, realize close loop control, ensure precise temperature technical window and even heat distribution. PL2015 Precise

Plastlist Group


mid-chip solder balling searches for Companies, Equipment, Machines, Suppliers & Information

SMT feeders

Training online, at your facility, or at one of our worldwide training centers"
Win Source Online Electronic parts

World's Best Reflow Oven Customizable for Unique Applications
Software for SMT

High Precision Fluid Dispensers
2024 Eptac IPC Certification Training Schedule

High Throughput Reflow Oven
PCB separator

"回流焊炉"