Petroferm offers a complete line of cleaning chemistries for use in immersion ultrasonic cleaning equipment. These cleaning materials are used for defluxing (removing post reflow solder paste residues) circuit boards and production fixtures, as well
New Equipment | Solder Materials
8 hrs. @ 30–45% RH & 22–25°C ~6 hrs. @ 45–70% RH & 22–25°C Stencil Cleaning Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using 99% isopropyl alcohol (IPA) works well. Storage and Handling Proce
New Equipment | Cleaning Agents
The ALPHA® range of cleaning products is specifically developed for electronic assembly manufacturing applications, such as stencil cleaners, PCB cleaning, and offers products for all major types of cleaning processes including: solvent-based, aqueou
Model No.: K0481 Product Origin: China Price Terms: FOB Shenzhen Payment Terms: T/T in advance Delivery Lead Time: within 7 days Features: 1) Made of highly absorbent, non-woven fabrics for removing spills or misprints 2) Superb tensile strength
New Equipment | Cleaning Agents
IONOX® BC is a general purpose semi-aqueous solvent blend specially designed for effective removal of flux residues and dried uncured adhesives. IONOX® BC is approved for manual stencil cleaning as well as underscreen wipe applications. Manufactur
New Equipment | Cleaning Agents
Broad Spectrum Electronics Cleaning Solvent IONOX® I3302 is a semi-aqueous solvent blend designed to remove difficult flux and paste residues including lead-free, rosin, no-clean, and tacky flux, as well as other common electronic assembly residues.
New Equipment | Cleaning Agents
MICRONOX® MX2302 is an engineered semiaqueous solvent blend designed to remove difficult flux and paste residues including lead-free, rosin, no-clean, and tacky flux from wafer bumps found in flip chip, chip scale and μBGA packages. MICRONOX® MX2302
New Equipment | Cleaning Agents
AQUANOX® A4639 is an engineered aqueous cleaning fluid that is effective on a wide range of soils at low operating temperatures and concentrations. AQUANOX® A4639 provides exceptional cleaning results and protection of metallic surfaces with minimal
New Equipment | Solder Materials
High Activity, Completely Odorless, No-clean Solder Paste Exceptional print definition Long stencil life Wide process window Excellent wetting compatibility on most board finishes Low voiding Compatible with enclosed printing
New Equipment | Solder Materials
8 hours), and abandon time (>4 hours) Printing: Suitable for high speed printing up to 150 mm/s Reflow: Solderable on challenging surface finishes (CuNiZn and Copper OSP) Colorless residues for easy post-reflow inspection Careful contr
