Electronics Forum | Sat Oct 18 20:35:25 EDT 2008 | arosario
I see, maybe changing my peak temp in reflow will help. I'll try do eval again... Actually, once I did have evaluated a longer pre-heat but on my previous eval, I didn't change the peak temp. Maybe reflow can help compensate to my problem in the part
Electronics Forum | Tue Oct 21 11:42:04 EDT 2008 | arosario
Hi Shooter, we're not using AOI but we do every 30 minutes sampling Inspection on the board and we're not seeing insufficient paste deposit so far since we started. But I agree with you that seemed my printer is not printing consistent amount of pa
Electronics Forum | Fri Oct 24 13:21:12 EDT 2008 | evtimov
Hello Bong, I would make one test only. Make one batch using the problem part from a different vendor. That will answer your main question. For me the part is causing all your problems. If it is possible, change it. Last time having problem like you
Electronics Forum | Fri Oct 17 22:36:35 EDT 2008 | arosario
Hi All, We just started build a new product and I am encountering many non-wet rejects in our new product. I need help on what should I look into to improve our Yield. Please see below back ground 1. We are using DEK Infinity as printer. 2. We are mo
Electronics Forum | Mon Sep 03 16:51:58 EDT 2001 | edmentzer
We have stored PCB's in the refrigerator twice when our old pick and place died during production. One time the boards were in the frig for two days. I put the boards in a tray and covered the tray with plastic food wrap. We waited about two hours
Electronics Forum | Sat Oct 18 09:30:43 EDT 2008 | hussman
Sounds like a part problem. You can SOMETIMES over come this with a hotter profile. We see this a lot with brokered parts. Seems like a lot of people are rejecting parts because a lot of companies haven't perfected their RoHS process, yet produce
Electronics Forum | Wed Sep 05 08:50:04 EDT 2001 | davef
No arument with others comments about moisture, but taking a different tact, consider that the volitle elements of the solder paste disppear as a function of the amount of time the paste is out of the container. [Maybe as a function of solder paste
Electronics Forum | Tue Aug 23 03:29:37 EDT 2022 | samhe
I received a buck-boost DCDC board with an optical sensor from NextPCB, so I mounted the components and measured the efficiency. Table of contents Board received from NextPCB Solder paste printing Mounting of parts Reflow operation check Attaching
Electronics Forum | Bob |
Wed Apr 07 19:40:07 EDT 1999
Electronics Forum | Fri Apr 09 08:58:28 EDT 1999 | Justin Medernach
| I'm not sure about limits but perhaps underfilling the BGA might easy your mind. Treat the BGA as something similar to a flip chip and dispense underfill around the part. The rigidity gained by the cured underfill may be enough to alleviate some
