Electronics Forum | Wed Feb 03 22:29:08 EST 2010 | mika
via apertures > solderding of terminals to the pads! That is zero which means => 90 % solderjoint Terminal to pad! http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=13914&#Message58952
Electronics Forum | Tue Oct 17 16:07:36 EDT 2006 | tds
Hi Tim (Nopper?), You should not have a cloud of flux comming out of your machine. Is your fluxer a resiprocating fluxer? Is it an ultrasonic spray head? I don't have your contact info any longer due to my laptop meeting my hammer. Send me a p
Electronics Forum | Mon Dec 18 08:52:57 EST 2006 | russ
You need to get yourself a copy of IPC 610. this has all the specs regrding placement and registration. chip aprts are allowed to have 50% side overhang. the fillet requirements are "evidence of wetted fillet" . I would not know if a cap being 51
Electronics Forum | Thu Jan 14 09:03:21 EST 2010 | cbart
I really don't have one, however our customers do. Since they see a spec in IPC for BGA's they have either addopted the 25% from the BGA spec or come up with their own. Also many have heard that IPC is working on defining critera. I was hoping othe
Electronics Forum | Mon Oct 16 16:01:42 EDT 2006 | timnop
I have a wave machine (offshore made) with internal spray fluxer configured with a conventional spray gun set up. In order to spray fluid (in this case, flux) I must set the air pressure at 0.3 mPA (43 PSI). At that pressure, my flux sprayer creates
Electronics Forum | Mon Oct 16 16:25:53 EDT 2006 | Cmiller
I think we run our Vectra between 9 to 14 PSI. If memory serves me, I dont think you can set it above 14 PSI. We use VOC free no-clean. Your number seems WAY high. Check the nozzle. You also may need a different nozzle size. We always run a good filt
Electronics Forum | Tue Nov 28 11:12:48 EST 2006 | billwestiet
The ONLY (unlikely) cause I could think of is if you are pushing the component into the solder, ending up with more solder on one side than the other. Why do you think it is the volume of solder that is causing this? By the way, there are "low tomb
Electronics Forum | Mon Dec 18 16:43:22 EST 2006 | darby
Boomerang, You said you are new to this so, First question. Are the components placed correctly with no offset pre-reflow? If the answer is yes then it's happening in the oven. Most likely cause is pcb design. If the answer is no then you have a pla
Electronics Forum | Wed Dec 09 10:45:56 EST 2015 | huske
I've put down a SOT223, close enough to your 3pin transistor, in the same situation you have. The large pin was to be soldered on a large exposed ground plane in the corner of a board, over 2"x2" exposed area. We left the paste file as is, so where
Electronics Forum | Thu Mar 28 11:37:08 EST 2002 | Bob
I have been looking at cross sectioned joints. In some instances there are areas where there are large concentrations of silver. Could anyone quantify what is too much and also explain how the intermetallics are formed. Thanks.
.png)
.gif)
winsouce.jpg)