Electronics Forum | Fri Apr 23 08:20:25 EDT 2004 | babe
Sometimes solder balling is related to oxidized paste or paste that has sat on the pcb too long before reflow. Mostly it is related to process, sorry... Too slow or too fast of a reflow ramp rate. Heating up an assembly too quickly will not allow the
Electronics Forum | Wed May 12 08:35:20 EDT 2004 | solderpro
yes this paste is a pain in the paste.... there are very few reasons for solderballs, component to pad ratio and placement.... solder paste control, using a mixer, not hand mixing, checking viscosity and temp..... or simply and bad profile and your
Electronics Forum | Thu Mar 03 18:09:06 EST 2005 | gpaelmo
We also use Indium NC-SMQ92J. We do the same as mentioned per Russ. We reduce apertures mostly on QFP's with pitch of 25 mil or less (we place down to 15 mil QFP). All other apertures we keep 1:1. We print resnet 0805 size with no problems. You might
Electronics Forum | Tue Mar 06 19:45:52 EST 2007 | davef
DPAK align on the tab with leaded solders. They don't align much with unleaded solders, but we know that your Indium NC-SMQ 92J is leaded. So, there may be too much paste on the heat sink tab causing the component to float [or wim] during reflow. If
Electronics Forum | Thu May 31 19:45:47 EDT 2007 | diesel_1t
We place a QFP 256 leads 20 mil pitch, had a lot of troubles with shifted components and solderability issues. solderability is not a problem anymore; we solved with a ramp-to-spike profile with .9�C/s 'til 183� then spike to about 118�C, TAL ~60s. W
Electronics Forum | Wed Aug 13 00:09:27 EDT 2008 | diesel_1t
Hi there. We have had troubles with pogo contamination on ICT fixtures causing false failures (Pictures attached). Currently we're spending about 10k on pogo replacement but still having problems. I recomended to clean pogos with a defluxer but Test
Electronics Forum | Thu Mar 22 13:06:50 EDT 2012 | smtmfgeng
Does anyone have any insight on alternatives to Indium NC-SMQ 92J solder paste for minimizing poor wetting on parts with oxidized leads (see datasheet here: http://www.dtsprocess.com/contents/articlefiles/6-SMQ92j.pdf). I am considering setting up a
Electronics Forum | Fri Jan 16 07:06:47 EST 2004 | Mika
Component manufacturer often have recommendation for pad layout and process setup. This should be used as a guideline to help You to set up the process. Exactly what type of component is this, uBGA? We populate 64 I/O uBGA's on our pcb's with 0.3 mm
Electronics Forum | Wed Feb 17 12:16:17 EST 2010 | dcell_1t
Hi there: During the past weeks (let's say since beginning of the year) we've been experiencing some issues with shifted components. We verify for position before Reflow oven and the components are Ok, but they observe shifted after reflow. it occurs
Electronics Forum | Wed Apr 09 17:39:30 EDT 2008 | diesel_1t
Hi. I know that this is one of the mos common threads here, I have been doing some research, but i didn't find any similar. The main issue is that I have seen tombstoning since two weeks ago, it is more characteristic on 0603 resistors (Stackpole e
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