Industry News | 2015-05-18 21:29:50.0
The SMTA Capital Chapter is pleased to announce its second meeting of 2015 on May 28th, scheduled from 5:30 pm to 8:00 pm at NTS Baltimore formerly Trace Labs, 5 North Park Drive, Hunt Valley, MD 21030. The focus of this chapter meeting will be “Failure Analysis Process for Printed Board Assemblies” presented by John M. Radman, Senior Applications Engineer, NTS Baltimore.
Industry News | 2001-01-23 10:52:31.0
IPC has honored 27 members at IPC SMEMA Council's Electronic Assembly Process Exhibition and Conference (APEXSM) in San Diego, CA for their contributions to IPC and the electronics industry.
Industry News | 2013-01-19 07:46:16.0
Information that inspires innovation is center-stage for design, printed boards, electronics assembly, test and printed electronics
StencilQuik demonstration video. This breakthrough method allows you to simplify placement/replacement saving 50% or more of time required to rework BGAs or CSPs.This is a well developed BGA rework method. More on the StencilQuik(TM) process here:
New Equipment | Solder Paste Stencils
Eliminate hours of solder mask damage repair time for bga sites while improving rework yield. Are you frustrated by the time it takes to repair mask damage underneath the BGA during the rework process? Are you squeezed for space on the PCB in an
New Equipment | Rework & Repair Equipment
BEST HeatShield Gel™ is a thermal shield water-based gel designed to be used in the PCB rework/repair or board assembly areas in order to provide thermal protection of electronic components. It is truly a revolutionary means to protect components. It
Industry News | 2016-04-20 10:27:40.0
BEST, Inc. was presented Circuit Assembly’s NPI Award for its HeatShield Gel™ high temperature shielding product at the IPC APEX Expo on Feb. 24 in San Diego, Calif.
Industry News | 2016-01-05 16:10:10.0
Novel method for protecting electronic components from heat.
Industry News | 2017-01-09 19:39:50.0
Gen3 Systems Limited will exhibit in Booth #3136 with Ascentech, LLC at the 2017 IPC APEX EXPO, scheduled to take place Feb. 14-16, 2017 at the San Diego Convention Center in California. Gen3 and Ascentech will demonstrate the new CM+ Series and AutoSIR 2/AutoCAF 2.
