Electronics Forum | Fri Mar 11 18:30:50 EST 2005 | davef
Russ: In December 2003, the European Commission released the following statement: �The commission services have prepared a draft Commission decision establishing maximum concentration values pursuant to Article5(1)(a) of Directive 2002/95/EC. The pr
Electronics Forum | Fri Nov 03 07:28:27 EST 2006 | davef
Via filling methods are: * Tenting * Plugging * Capping * Flooding Tented Via. A via covered with dry film soldermask; the via is not filled. When tenting from both sides there may be issues with trapped air that expands during mass soldering. Plug
Electronics Forum | Tue Nov 28 21:16:17 EST 2006 | davef
J Rose at EMPF says: The introduction of no-clean solder fluxes in electronics manufacturing has given rise to greater levels of solder balling simply because the opportunity to remove them in the wash process does not exist. They are typically cause
Electronics Forum | Tue Aug 16 07:51:16 EDT 2011 | a
C-SAM is a non-destructive alternative that a lot laboratories and chip manufacturers use. Dye and Pry would work I suppose although I have never done it in practice with PoP but it should be any different for PoP.
Electronics Forum | Fri Aug 19 02:16:40 EDT 2011 | ppcbs
In my opinion destructive methods went out with the stone age. At least they did at our company. We specialize in non-destructive defect analysis. We can determine where the failure is i.e. assembly process, fab defect, BGA defect or plating proce
Electronics Forum | Wed Dec 12 11:35:26 EST 2012 | rway
I work for an electronics manufacture. Our end product is on PCBAs. My question is related to the use of safety glasses, which I know are required when doing rework. But here is the question: We ordered side shields for prescription glasses. Wha
Electronics Forum | Sat Apr 28 02:20:43 EDT 2007 | basem
Grant-Thanks for letting me know that MyData is made in non-U.S. made machine. Cal-Thanks, I will be sending you an email to your email account you have provided. I have contact MIMOT already, however, they are VERY expensive machines and it will no
Electronics Forum | Thu Jun 03 13:11:02 EDT 2004 | Scott B
We had an existing Mydata MY15 line and inherited 2 Quad lines (QSP2 and QSX1). We eventually had to get rid of the 2 Quads (major software and hardware issues) and have replaced these two machines with an addition single Mydata MY15 and are getting
Electronics Forum | Tue Mar 07 21:35:16 EST 2006 | Cal Kolokoy
Samir, From experience, the only board test situation where tented via's have difficulty with contact is with a Flying Probe type tester. Otherwise, for traditional ICT, the force of the pogo pins, correct probe type, and fixture design should do th
Electronics Forum | Fri Apr 27 12:38:40 EDT 2007 | Cal
Basem, I worked directly with both Essemtec and Dima and if you send me an email I can help provide direction. cal_Driscoll@hotmail.com Unfortunately,I have been out of the SMT world for almost 4 years now. I would lean more towrds the Essemtec as
