Events Calendar | Tue Apr 06 00:00:00 EDT 2021 - Tue Apr 06 00:00:00 EDT 2021 | ,
Capital Chapter Webinar: Next Gen Lead Free Solders for High Reliability & SMT Yield improvement
Events Calendar | Wed Jul 13 00:00:00 EDT 2022 - Wed Jul 13 00:00:00 EDT 2022 | Oshkosh, Wisconsin USA
Wisconsin Chapter: PCB Workshop and PCB Plant Tour
Industry News | 2021-06-30 04:28:57.0
Increases process capacity for large PCB panels by more than 54% with only 2% increase in footprint
Industry News | 2021-08-13 12:08:30.0
Online training for new, recently hired, and transitioning engineers
Industry News | 2012-07-12 16:39:49.0
— IPC — Association Connecting Electronics Industries® has released IPC-1758, Declaration Requirements for Shipping, Pack and Packing Materials.
Industry News | 2019-11-27 12:07:07.0
New Spanish-language website provides an educational resource for a wider range of professionals in the cable and wire harness industry.
Events Calendar | Tue Jul 11 00:00:00 EDT 2023 - Tue Jul 11 00:00:00 EDT 2023 | Oshkosh, Wisconsin USA
Wisconsin Chapter In-Person Event: PCB Workshop and PCB Plant Tour
Events Calendar | Wed Sep 11 00:00:00 EDT 2024 - Wed Sep 11 00:00:00 EDT 2024 | Oshkosh, Wisconsin USA
Wisconsin Chapter In-Person Event: PCB Workshop and PCB Plant Tour
Industry News | 2010-08-25 14:48:18.0
IPC — Association Connecting Electronics Industries® announces a new automated testing feature now available for purchasers of IPC electronics assembly DVD or OVT (Online Video Training) products. Automated testing can be used in conjunction with any of IPC’s extensive library of electronics assembly training videos, verifying understanding in key subject areas.
Industry News | 2010-09-13 15:36:15.0
IPC — Association Connecting Electronics Industries® has released IPC-1601, Printed Board Handling and Storage Guidelines. The industry's sole standard on the handling, packaging and storage of printed boards, IPC-1601 provides users with guidance on how to protect printed boards from contamination, physical damage, solderability degradation, electrostatic discharge and moisture uptake.