Electronics Forum | Thu Feb 03 21:20:50 EST 2000 | Dave F
Ignacio: Try: Electronic Packaging & Interconnection Handbook, Harper, (ISBN 0070266948) Printed Circuit Board Materials Handbook Jawitz, MW McGraw-Hill 1997 (ISBN 0070324883) merix.com/resourcecntr/materials/mtl_property_comp.html norplex.com/TD_L
Electronics Forum | Thu Nov 19 11:06:40 EST 1998 | Earl Moon
| We have some PCB�s in our warehouse in Manaus - Brazil. They are stored for more than 2 years , in a condition of 25 degrees centigrades and a humidity ranging from 60% to 90%. | Do these conditions cause the PCB�s to deteriorate over time? If so ,
Electronics Forum | Tue Dec 11 15:10:11 EST 2018 | med_cezir
Hi Everyone We setup a new smt line consisting from ys24 and ys12. When creating new programs I used stock names and added to database but after a while I recognized even if I used same package before I have to add it again because stock number is n
Electronics Forum | Mon Aug 22 06:30:59 EDT 2011 | janz
very often toes on the QFP packages are exposed to base material and during time they oxidize. That is why you can have problem with solder fillet. Most important is heel fillet. Regarding your misalignment of IC if this is repeatable check your pl
Electronics Forum | Wed Jan 09 09:31:53 EST 2008 | flipit
I solder LEDs everyday from 0402 sizes on up. I work for an optical company so every product I make has LEDs. Some products have hundreds of LEDs per circuit. The problem is that clear materials are not filled materials and thus don't have the adv
Electronics Forum | Tue Dec 14 02:19:03 EST 2010 | sachu_70
With lower Humidity levels, we expose to greater risk towards ESD related failures seen on components. Pl. ensure to have your entire work area fully guarded against ESD and maintain proper material handling instructions across the entire flowline un
Electronics Forum | Fri Nov 16 08:46:30 EST 2007 | jdengler
For very simple boards, 2 layers lightly populated with light thermal mass, we still use FR4. For most of our Pb-Free boards we use the higher Tg material with moisture-resistant packaging. We are a CM so we don't usually get to change many of the
Electronics Forum | Fri Oct 08 17:03:03 EDT 1999 | Dave F
| Hi, | | Help! Could anyone help to enlighten me on this? | | Question: | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a normal water cl
Electronics Forum | Thu Jun 29 11:08:55 EDT 2000 | Dave F
Kok Han: Good to hear from you. Please help us understand you situation better by talking more about: � Component IC of the RF unit (IC101). For instance: SMT / PTH, package, pitch, lead material, lead finish, package type, package weight, coplan
Electronics Forum | Tue May 27 12:40:50 EDT 2003 | davef
Hi Bill You said, "silicon". We assume by your discussion that you ment to say, "silicone". For background on silicone and soldering, check with Dow Corning [517-496-6000]. They make a OS2 [VOC-free] silicone stripper and should be able to give y
