Electronics Forum | Fri Jan 16 23:33:32 EST 1998 | Scott
| Is there any way to implement SMT at home? | I want to assemble a prototype board of mine. | How can I hand-solder a 208-pin 0.5 mm lead | pitch PQFP -- lead-by-lead (the usual way), | or side-by-side (partial heating method)? | Alas, no SMD rework
Electronics Forum | Wed Jul 28 09:15:46 EDT 2010 | vetteboy86
I took a pad that did not have any solder flow (wetting issue with pad) and not reworkable with soldering iron, and scraped with an exacto knife. After scraping the pad soldered fine. Any suggestions?
Electronics Forum | Thu Dec 14 14:29:53 EST 2017 | barryg
We did check for oven clearance thinking the same , but there is plenty clearance. We have however found that the problem was on several lots of PCBs. We ran a fresh lot and problem went away. There appears to be some kind of contamination on the PCb
Electronics Forum | Tue Apr 15 21:24:41 EDT 2008 | davef
We find it curious that: * Heat slug pad for Q19 didn't take solder, indicating a pad [board] solderability issue. * Signal termination pads for Q19 didn't flow well, indicating a poor thermal recipe or a pad [board] solderability issue. * Signal ter
Electronics Forum | Mon Jan 23 19:48:27 EST 2012 | gaz
This make me curious how many people are using sn100 versus how many using sac305. The sn100 seemed to generally cover the pads and flow a little better, and looked nicer, but SAC305 overall was easier. Is this normal or do I need to work more on sa
Electronics Forum | Wed Jun 29 06:57:20 EDT 2005 | mattkehoe
Hi Bob, We tried flowing the pads with a soldering iron. The pad at the tip of the iron went shiny but as soon as the iron was taken away, the pad returned to the dull finish. You could actually move the tip around the pad and it would shine up then
Electronics Forum | Mon Jul 19 14:58:50 EDT 2004 | mattkehoe
We have a need for expert opinions on a solderability issue. Our company prints and then reflows solder paste with no components in place. It is then washed and flattened with a special flattening machine. Usually, the paste fuses and spreads out
Electronics Forum | Tue Jul 24 20:00:40 EDT 2001 | davef
There is too little heat to make the solder flow properly. Test this theory by profiling on the pad where the solder doesn�t flow well. As the time after posting this thread increases, we generally propose additional theories. Rather than us specu
Electronics Forum | Thu Sep 13 18:00:35 EDT 2012 | mark25y2001
possible problem are loading orientation, solder flow cannot reach the pad portion due to trap of the body of the diode... or try to adjust turbulent but observe overflow... because turbulent are penetrate solder to pad and terminal of the diode. ho
Electronics Forum | Mon Jun 13 12:52:33 EDT 2022 | leeg1
Has the part not got a pad underneath and therefore the flow up the castellated side doesn't have to be as crucial?
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