Dicer/ Wire Bonder/ Die Attached/ Prober/ Tester/ SEM/ Handler....etc.
Eclipse Industries manufactures the ultra-high precision DS-107 Aligner Bonder, alignment to 1-2 microns, bond force 5 gm to 100 kg. Applications are flip chip, die bonding, CSP, uBGA, MCM, flat panel displays, die-to-wafer & optoelectronics.
Industry News | 2003-06-19 09:00:08.0
Leading provider of manufacturing services applies
Industry Directory | Equipment Dealer / Broker / Auctions
Trading of Used Electronics and Semiconductor Machines and Equipment
Industry Directory | Manufacturer
Since 1980, the Dr. Tresky AG company has been supplying the micro- and opto- electronics industry with innovative component placers and die bonders.
Used SMT Equipment | SMT Equipment
ASM Bonding machine for sales : Wedge Bonder AB530 Dispenser DS500 Die Attach AD896 Few sets for each unit Please e-mail to customerst@163.com
Career Center | Melbourne, Florida USA | Engineering,Production,Quality Control
Engineering Specialist - Advanced Manufacturing Technology organization Palm Bay, Florida � GCSD01041082 Job Description: Work in the Advanced Manufacturing Technology organization on the development, qualification, and implementation of leading-edg
Eclipse Industries DS-107 Aligner Bonder The DS-107 Aligner Bonder is an ultra-high precision, high or low force aligner bonder. Constructed on a granite platform for superior stability and rigidity, the DS-107 is designed for alignment accuracy of
