Electronics Forum | Wed Dec 22 08:49:55 EST 2004 | markhoch
I'm looking for some data to support my argument that HASL boards are not the most ideal boards for manufacturing involving BGA's and 0402's. I'm sure one of you SMT Gurus out there can point me in the right direction! Thank you in advance!
Electronics Forum | Sun Jul 14 05:37:17 EDT 2002 | johnw
Hi all bga placcement on an ip2 can is possible although as pointed out the x/y dimensionsof the part are used for placement I would suggest you arrange for your parts to be taped and reeled as this is the prefered way to go what size are the bga,s
Electronics Forum | Fri Feb 22 13:55:27 EST 2019 | bruce_mackean
Is there a need for a simple application to merge a bill of material with the xy placement data into a single (or top/bottom) files for machine programming? ie. add a part number column to the xy data, including "N/A" for parts not found in the BoM?
Electronics Forum | Fri May 22 22:13:18 EDT 2020 | gabriel1blue
Hi guys we had problems with our old pick and place machines and all the parts data and mark data was lost when we had to restart the machine. We made a copy but it has been so long that we used it that now it's not working. I hope someone has one of
Electronics Forum | Thu Jul 11 20:36:43 EDT 2002 | cyber_wolf
It will place BGA's, but you will be centering by using the part outline. The IP2 cannot be adapted to do individual ball inspection.(You may already know this) As far as getting the part to stay on the part shuttle, I am sure that there is somethin
Electronics Forum | Tue Jan 31 14:30:38 EST 2006 | Chunks
There is none, since we don't know your part or temp being used. A heat gun CAN be used to remove parts with no damage, if its controled. You need to look up your part on the manufacturers web site, find the process data (time/temp)the part is desi
Electronics Forum | Thu Feb 12 10:19:46 EST 2004 | Bryan
Hi all, These days our customer asks us to figure out ,during reflow,the BGA ball and solder paste,which will first melt? I think it's very hard to get the rusult.coz I think it'll vary at diffrent part of the BGA,and how can this affect the perf
Electronics Forum | Fri Feb 13 11:46:23 EST 2004 | Jack
Is your customer trying to reduce voiding? If the device is using Sn90 / Pb10 and the paste is Sn63/Pb37 the board will melt first. However, if both solders are 183C eutectic, it's a tossup? PCB design, copper weight, bga type (pbga, micro bga, Tbg
Electronics Forum | Thu May 12 08:29:54 EDT 2011 | don7888
Hi I am looking at reducing the time it takes for our operators to complete a first off on the first board that comes off the p+p machine. I started off by conducting some RCA to find out what was the main cause of boards failing the first off. From
Electronics Forum | Fri Feb 06 03:56:47 EST 2004 | JaMi Smith
BGAs and QFPs packaged in Trays are oriented with Pin 1 or corner A1 oriented towards the Pin 1 identifier on one corner of the Tray, which is usually identified by a chamfered corner. The Trays themselves are usually governed by JEDEC Registered Ou
