Electronics Forum | Tue Nov 21 09:46:19 EST 2006 | jax
I assume you are talking about Sn62Pb36Ag2 solder. You should not see any added concerns when subjecting Sn62 to multiple reflow cycles as compared to Sn63. As compared to Sn63Pb37: Reduced leaching issues Increased Wetting due to lo
Electronics Forum | Wed Oct 10 02:04:10 EDT 2007 | omidjuve
hi we use a no clean solder paste with the sn63pb37 alloy and our high frquency board doesn`t have any problem in test but after this product is finished now we use 2 different solder pastes 1. sn62 pb36 Ag.4 RA tape 2. NC type lead free with Ag i
Electronics Forum | Thu Apr 10 07:47:47 EDT 2008 | ck_the_flip
Stencil design and pad layout are key. Too far apart - bad. If your pad geometry is correct, try the inverted home plate. That has worked well for me in the past. That, coupled with a 5-mil stencil. With regard to solder paste, some manufacturer
Electronics Forum | Tue Nov 30 18:02:45 EST 2010 | flipit
62/36/2 is used often in thickfilm hybrid circuits where Pd/Ag conductors are used. The idea is that you saturate the joint with the 2% silver and thus help eliminate the leaching of the silver from the hybrid circuit pads or the component. We mix
Electronics Forum | Mon Apr 01 17:20:45 EDT 2013 | davef
In thinking about troubleshooting tombstoning {TS} defects, seek balance: * Pads the same size * Same amount of paste on each pad * Component placed with the same amount of contact on each pad * Heating the same on each pad, no via connection to a gr
Electronics Forum | Mon Apr 19 02:45:31 EDT 1999 | Brian Sloth Bentzen
| | We process both tin/lead plated boards and gold plated boards in our surface mount group. I have used Sn62/Pb36/Ag2 solder paste on all gold plated boards to help prevent gold scavaging. To reduce the amount of different solder pastes we have t
Electronics Forum | Thu Sep 16 20:55:35 EDT 1999 | Dave F
| | We have some SMT components with gold plated leads. They're actually LCC led packages. A good solder alloy to use would be Indium / Lead to reduce tin dissolution into the gold and avoid the resultant brittle intermetallic compound. However, a re
Electronics Forum | Thu Jul 01 16:43:52 EDT 1999 | Dave F
| | | Could somebody tell me what means Leaching, ie: "Leaching of terminal end face exposing the ceramic"? | | | | | Roberto: Leaching, according to the SMTnet Library of Terms: | | | | Leaching. Dissolution of a metal coating into liquid solder.
Electronics Forum | Thu Sep 16 18:07:16 EDT 1999 | Earl Moon
| We have some SMT components with gold plated leads. They're actually LCC led packages. A good solder alloy to use would be Indium / Lead to reduce tin dissolution into the gold and avoid the resultant brittle intermetallic compound. However, a reco
Electronics Forum | Fri Apr 24 20:33:06 EDT 1998 | D.Lange
| Looking for anyone who has experience with high temperature soldering. Need to determine why solder joints are failing. Thermocycling of unit is -40C to +140C, 30 minute dwell time, 10 sec. transition time | Your help is appreciated | Ed Holton |
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