Electronics Forum | Fri Nov 09 08:18:25 EST 2007 | mulder0990
In regards to the Torque tester from Fuji that tests the peel back force, you can buy that directly from Fuji for $250.
Electronics Forum | Wed Aug 25 17:48:08 EDT 2010 | fdr4prez
Hey, great, thanks! Now I can check with my machine maker and see what their feeders are spec'd to. I may send a reel of parts out to be tested, too.
Electronics Forum | Wed Aug 25 12:13:40 EDT 2010 | remullis
You may want to search on "Cover Tape", what date code is on the parts reel? I have multiple issues with cover tape sticking to the paper and not peeling back. Causes pick errors due to the part being covered. I think my problem is the parts have too
Electronics Forum | Tue Oct 23 22:12:57 EDT 2007 | davef
1 Tape & reel, automatic * RVSI/Systemation ST-60 * Shinkawa SDP-FA-TAPE 1 * V-TEK TM-5100 * Q Corporation QMT-1500 2 Tape & reel, manual * RVSI/Systemation MT-30 * V-TEK TM-50XL * Q Corporation QMT-1100 3 Tape & reel, peel force tester * RVSI/Syste
Electronics Forum | Sun Apr 25 02:58:58 EDT 1999 | Haim H.
| Hey Ya'll! | | Have any of you ever worked with one of V-Tek's "Economax" tape and reel machines? The biggest thing I'm curious about is the type of cover tape that these machines use. It's something they call P.S.A. (Pressure Sensitive Adhesive)c
Electronics Forum | Thu Apr 22 13:43:14 EDT 1999 | Steve Gregory
Hey Ya'll! Have any of you ever worked with one of V-Tek's "Economax" tape and reel machines? The biggest thing I'm curious about is the type of cover tape that these machines use. It's something they call P.S.A. (Pressure Sensitive Adhesive)cover t
Electronics Forum | Fri Apr 23 17:44:50 EDT 1999 | Stefan Witte
| Hey Ya'll! | | Have any of you ever worked with one of V-Tek's "Economax" tape and reel machines? The biggest thing I'm curious about is the type of cover tape that these machines use. It's something they call P.S.A. (Pressure Sensitive Adhesive)c
Electronics Forum | Tue May 23 20:39:37 EDT 2000 | Dave F
Scott: Sounds like fun: � Solder joint strength in pull/shear varies with lead geometry, solder volume, lead metal/metallization, and the test method. � Among things, IPC-TM-650 talks to getting pads off-of boards. For instance: Method 2.4.8 is for
Electronics Forum | Fri May 22 16:08:05 EDT 1998 | Steve Gregory
Hi ya' Mike! For low temperature baking, IPC-SM-786A (Procedures for Characterizing and Handling of Moisture/Reflow Sensitive IC's) specifies a low temperature bake that can be done in the component shipping packaging...ya' wanna remove the bubb
Electronics Forum | Thu Jul 09 21:04:50 EDT 1998 | Dave F
| Hi there, | I am looking for some informations concerning the shear or pull strength of a typical TQFP 20 mils leads in relationship with the Copper/Tin intermetalic layer thickness. Could anyone help? | | Thank in advandce. | rgs, | chiakl Chiakl
