Electronics Forum: philips and smt and 101 (Page 3 of 3)

"Gap" in completed solder joint between lead and pad

Electronics Forum | Thu Nov 30 16:10:05 EST 2006 | Hussman

Wow, why all the anger? This gap you guys are talking about is measured as "G" in IPC/EIA J-STD-001 (Chunks was there, but she failed to read the fine print). And almost all parts that measure G follow Note 3 which states "Properly wetted fillet s

Integration of manual odd form / low volume pick and place

Electronics Forum | Tue Sep 10 08:01:47 EDT 2002 | mpotter

Kevin If you want to go automated then why not take a look at the Philips ACM. It is the flagship for placing SMT and Oddform packages. We use Vacuum nozzles and Grippers to handle many truly oddform components.

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