Industry News | 2022-04-20 14:38:49.0
Rockwell Automation, Inc. announced today that registration is now open for ROKLive, a Rockwell Automation and Plex Systems event taking place June 13-16 in Orlando, Fla. Joining with newly acquired Plex's annual PowerPlex event, the in-person ROKLive experience will bring together operations, maintenance, engineering and technology leaders and innovators to explore how Rockwell Automation's enterprise-wide solutions are linking OT and IT like never before.
Industry News | 2008-04-22 20:28:50.0
The IEEE International Reliability Physics Symposium's (IRPS) 46th annual conference announces the keynote speaker of this year's event will be Dr. Michael Pecht, chair professor and the director of the Center for Advanced Life Cycle Engineering (CALCE) at the University of Maryland.
Industry News | 2015-04-21 17:10:49.0
Saki Corporation will demonstrate its BF-3Di automated optical inspection and BF-3Si automated solder paste inspection systems at SMT Hybrid Packaging, Nuremberg, Germany, May 5-7 2015, in Stand 7-331.
Industry News | 2016-04-04 09:33:43.0
Nordson DAGE, MatriX Technologies and Nordson YESTECH, divisions of Nordson Corporation (NASDAQ: NDSN), will exhibit their range of market leading Test and Inspection systems in Hall 7A, Booth 329 at the forthcoming SMT/Hybrid/Packaging, scheduled to take place April 26-28, 2016 at the Messe in Nuremberg, Germany.
Industry News | 2003-03-11 21:51:18.0
New release compares netlists to identify test points moved, added, deleted, renamed or re-assigned in Excel and HTML reports.
Industry News | 2013-11-08 17:55:20.0
Several Indium Corporation technology experts will present at the inaugural IPC Conference on Solder and Reliability November 13-14 in Costa Mesa, California.
Industry News | 2010-11-15 22:12:10.0
Data I/O Corporation and Matthew Associates will showcase the FlashPak III and ProLINE-RoadRunner™ systems at the upcoming SMTA Nutmeg Expo & Tech Forum
Industry News | 2008-11-06 10:05:03.0
Pressure-Indicating Sensor Film Useful in PCB Lamination and other Applications
Industry News | 2010-09-27 23:15:26.0
VJ Technologies, Inc., the leader in rework technologies and global provider of advanced X-ray inspection systems, announces that Intel’s James Wade and Raiyo Aspandiar, along with VJ Technologies’ Donald Naugler and Terry Leahy will present a paper titled “PCB Pad Site Dress Methods on BGA and Socket Pad Arrays” at the upcoming SMTA International, scheduled to take place October 24 - 28, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL.
Industry News | 2016-02-17 16:31:00.0
Akrometrix LLC will exhibit in Booth #1623 at the 2016 IPC APEX EXPO, scheduled to take place March 15-17, 2016 at the Las Vegas Convention Center. Company representatives will discuss Akrometric’s TherMoire’ AXP modular metrology platform that provides shadow moire’, digital fringe projection and digital image correlation capabilities in one platform. Akrometrix also will demonstrate its new Real-Time Analysis Software along with Array Generation Software (for thermal warpage measurement and partitioning of wafers) and Interface Analysis Software that allows high level and in-depth review of the attachment interface between two surfaces that warp during microelectronics and electronic assembly production reflow processes.
