ASCEN technology specializing the PCB assembly equipment and the SMT solution. Please check the more detail link : www.pcb-separator.com Any inquiry please sent the email to : info@pcbasc.com , and add the Skype NO.: supplier889 This is our mult
Main product: SMT Assembly Reflow Oven, SMT Hot Air Reflow Oven, Lead Free Reflow Oven, SMT Reflow Oven, SMT Mounting Machine, Elctronic Equipment, PCB Machine, reflow oven, SMT Assembly, SMT/SMD Equipment, PCB Printer, screen printing SMT assembly
Full Hot Air Lead-Free Reflow Oven With PC Temp Control System (A800) Introduce: 1, Heating system adopts ETA patent heating technology 2, The use of imported large current solid state relay contact output, safe, reliable, equipped with a dedicated
New Equipment | Rework & Repair Equipment
BGA Rework Stations from the BGA Experts with over 25 years rework process experience and customer support! For high volume BGA Rework on even the largest computer and networking boards! The model SV560A has a high resolution optical system for pla
The more detail and video please check the link: www.pcb-separator.com This machine specializing the LED aluminum board. and very popular in Europe .It can cut the board with the led chip no damage and no bend. Our SMT automation equipment
The more detail and video please check the link: www.pcb-separator.com This machine specialising the LED assembly industry. with the high precision and all with the CE certify.It use the Europe quality standard and different from our other
The more detail and video please check the link: www.pcb-separator.com This machine specialising the LED assembly industry. with the high precision and all with the CE certify.It can cut the board with the led chip no damage and no bend. W
ASCEN 900 model PCB depaneling machine with high precision and high efficient, it is very popular use for LED assembly production line. Mcutter PCB depanelizer can depaneling the whole LED panel at one time. It is different from our single cutter
New Equipment | Solder Paste Stencils
These fixture plates facilitate the controlled dipping of flux or paste onto the balls under the BGA packages. Flux or paste is controlled at a depth of 50-60% per cent of the ball diameter prior to placement of a BGA or to place a PoP component on t
New Equipment | Solder Paste Stencils
These fixture plates facilitate the controlled dipping of flux or paste onto the balls under the BGA packages. Flux or paste is controlled at a depth of 50-60% per cent of the ball diameter prior to placement of a BGA or to place a PoP component on t
