Electronics Forum: plugged vias bubbles (Page 3 of 17)

Solder Mask Bubbling On PCB from Supported Via Holes

Electronics Forum | Mon Jul 14 12:55:07 EDT 2008 | arminski

I have a board with the above problem from our PCB supplier. After they applied the solder mask and run the PCB's to HASL process, the solder mask bubbled on one side of the PCB making the solder mask thickness higher and PCB looking awkward. They s

via hole plugging

Electronics Forum | Wed May 19 11:50:32 EDT 1999 | Chris Nuttall

We care currently running into problems during our plug via process: At the moment we plug prior to soldermask (LPISM) using epoxy resin - plugging takes place from the component side - however we are seeing solderballs after solder level.This is cau

solder pop out from via hole at secondary reflow

Electronics Forum | Mon Jul 08 14:41:17 EDT 2002 | davef

See what happens when you take a couple of days off? Your theory sounds reasonable, but someone else could make an equally valid case that you are blasting your solder plug across the room with the force of the expansion of entapped air between th

Tented Via's

Electronics Forum | Thu Feb 21 16:57:02 EST 2008 | flipit

If the vias are large and don't always tent, you can have your pcb supplier double mask the pcb. I do this for COB assembly sometimes because the globtop wicks through the vias and also causes air bubbles in the globtop.

Solder Mask Bubbling On PCB from Supported Via Holes

Electronics Forum | Tue Jul 15 17:54:57 EDT 2008 | arminski

thanks sir! you explained it very well.... thanks a lot!

Solder Mask Bubbling On PCB from Supported Via Holes

Electronics Forum | Wed Jul 16 19:07:59 EDT 2008 | boardhouse

Your Welcome.

Micro-BGA soldering

Electronics Forum | Mon Jul 26 12:55:34 EDT 1999 | M.L

Presently protos of micro-bgas (80i/o) pitch .030/.031 12BGA per assembly The board is a (.062, 4 layers) FR-4 using Dry film Pads .014inch Vias within footprint .020inch Vias to be filled by bottom side(solder side) only .030in dia. Force via plugg

BGA void removal

Electronics Forum | Mon Sep 30 09:26:04 EDT 2002 | itempea

Russ, first step would be to get IPC-7095 on BGAs. A few notes: There can be voids in solder balls, or at the solder joints to the BGA, or at the solder joints to the PCB. Various sources or reasons can be responsible for these voids. Voids can be

Via-in-pad

Electronics Forum | Mon Mar 07 10:14:31 EST 2005 | jmedernach

Cellular and PDA architectures employ this technology all the time. You have to be careful with your board supplier as well as with your plugging approach. Leave the via unplugged, I guarantee voids in the solder joint. That leaves us with, "how d

Plugging of via through holes

Electronics Forum | Wed Jul 23 03:04:57 EDT 2008 | gfro

Hello, We are using a PCB with thickness 3.2mm 4 layer and lot of through hole via's of diameter 0.4mm. We specified our PCB vendor to do plugging. Now we have big problems, that after 1..4 weeks we measure a low resistance between track's/via's of


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