Electronics Forum | Mon Jul 14 12:55:07 EDT 2008 | arminski
I have a board with the above problem from our PCB supplier. After they applied the solder mask and run the PCB's to HASL process, the solder mask bubbled on one side of the PCB making the solder mask thickness higher and PCB looking awkward. They s
Electronics Forum | Wed May 19 11:50:32 EDT 1999 | Chris Nuttall
We care currently running into problems during our plug via process: At the moment we plug prior to soldermask (LPISM) using epoxy resin - plugging takes place from the component side - however we are seeing solderballs after solder level.This is cau
Electronics Forum | Mon Jul 08 14:41:17 EDT 2002 | davef
See what happens when you take a couple of days off? Your theory sounds reasonable, but someone else could make an equally valid case that you are blasting your solder plug across the room with the force of the expansion of entapped air between th
Electronics Forum | Thu Feb 21 16:57:02 EST 2008 | flipit
If the vias are large and don't always tent, you can have your pcb supplier double mask the pcb. I do this for COB assembly sometimes because the globtop wicks through the vias and also causes air bubbles in the globtop.
Electronics Forum | Tue Jul 15 17:54:57 EDT 2008 | arminski
thanks sir! you explained it very well.... thanks a lot!
Electronics Forum | Wed Jul 16 19:07:59 EDT 2008 | boardhouse
Your Welcome.
Electronics Forum | Mon Jul 26 12:55:34 EDT 1999 | M.L
Presently protos of micro-bgas (80i/o) pitch .030/.031 12BGA per assembly The board is a (.062, 4 layers) FR-4 using Dry film Pads .014inch Vias within footprint .020inch Vias to be filled by bottom side(solder side) only .030in dia. Force via plugg
Electronics Forum | Mon Sep 30 09:26:04 EDT 2002 | itempea
Russ, first step would be to get IPC-7095 on BGAs. A few notes: There can be voids in solder balls, or at the solder joints to the BGA, or at the solder joints to the PCB. Various sources or reasons can be responsible for these voids. Voids can be
Electronics Forum | Mon Mar 07 10:14:31 EST 2005 | jmedernach
Cellular and PDA architectures employ this technology all the time. You have to be careful with your board supplier as well as with your plugging approach. Leave the via unplugged, I guarantee voids in the solder joint. That leaves us with, "how d
Electronics Forum | Wed Jul 23 03:04:57 EDT 2008 | gfro
Hello, We are using a PCB with thickness 3.2mm 4 layer and lot of through hole via's of diameter 0.4mm. We specified our PCB vendor to do plugging. Now we have big problems, that after 1..4 weeks we measure a low resistance between track's/via's of
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