Microelectronics and Semiconductor Inspection. MVP's 850G provides the highest accuracy flip-chip, die assembly inspection. Ensuring the correct placement of the die on the substrate, while providing edge, FM and surface inspection. The 850G modu
The TR7700QE AOI offers high performance 3D solder and assembly inspection by combining the next generation 2D and 3D technologies based on 4-way adaptive digital fringe pattern projection. Latest inspection software ensures quick CAD-based programmi
The new system delivers high-speed (5,700mm2/sec), high-accuracy (XY positioning of 3µm at 3?), height repeatability (below 2µm at 3?), and scalable resolutions of 7, 12 and 18µm for boards weighing 12kg. http://www.sakiglobal.com/automated-optical-i
Key Factor 1: Advanced Hardware Features Proprietary Hardware provides accurate measurements Saki's machines are built with hardware that's made to last. A closed-loop, dual servo motor drive system, high-resolution linear scale, and rigid gant
ScanPLACE provides a sophisticated and user-friendly alternative to complex CAM software packages and inaccurate, time consuming manual inspection and programming methods that cost assembly houses productivity, time and money. Programming Using a
New Equipment | Design Services
High Quality wireless android Bluetooth GPRS tablet with RFID Reader Please contact me when you get a chance: Email:andy@vanch.net skype:andyzhou60 whatsapp:008613477040905 Parameter Description Mode
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New Equipment | Industrial Automation
Sales Manager: Sandy Lin Email: unity@mvme.cn Skype:onlywnn_1 Mobile(Whatsapp): (+86)-18020776786 yuehang: Shipping Term : TNT,DHL,FEDEX,ETC Payment Term : T/T Warranty: 12 month yuehang supply： New+original+factory sealed+high quality
SAKI 3D AOI 3Di LS2 single lane AOI PCB size:50x60-330x330mm Dimension:1040x1440x1500mm weight:900KG Product description: SAKI 3D AOI 3Di LS2, Single lane AOI, PCB size:50x60-330x330mm, Dimension:1040x1440x1500mm, weight:900KG SAKI 3D AOI 3
SAKI 3D AOI 3Di ZS2 Single lane AOI PCB size: Max. 330x330mm Dimension:1340x1440x1500mm weight:900KG INQUIRY SAKI 3D AOI 3Di ZS2 Specifications: 1: Advanced Hardware Features Proprietary Hardware provides accurate measurements Saki's mac
Industry News | 2013-05-22 11:33:31.0
ADLINK Technology announced the release of its new EOS-1220 GigE Vision-compliant embedded vision system, featuring 3rd Generation Intel® Core™ i7 quad core processors, four independent PoE (power over Ethernet) ports, full compatibility with GigE Vision cameras and support for smart PoE APIs, allowing remote switching of PoE status. With high-end CPUs and multi-channel connectivity in a compact housing, the EOS-1220 is ideally suited to multi-camera imaging applications such as 3D robot guidance.
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