Electronics Forum | Mon Sep 11 14:58:16 EDT 2006 | cuculi54986@yahoo.com
Steve, Let me guess, you were using this one: http://www.panasonic.com/industrial/components/pdf/abd0000ce10.pdf That part sucks. They have a newer part number that is supposedly "reflow-friendly". Unfortunately, I can't convince our quality de
Electronics Forum | Fri Sep 08 09:16:37 EDT 2006 | james
We are incurring problems with Film Chip Capacitors with reflow issues. Some of the parts are misaligning or not soldering on one end (almost tombstoning) . We left the parts in the dry cabinet till they were used. We tried both reflow ovens (hell
Electronics Forum | Wed Jun 25 11:06:35 EDT 2003 | James
Does anyone else have the same problem with BGAs that have a gold corner. It looks like the area where the gold corner is, it does not want to reflow proberly but the rest of the BGA reflows fine. Any suggestions????
Electronics Forum | Fri May 24 07:53:13 EDT 2024 | davidk
In our company we are facing the problem at our SMT line with component: relay panasonic TX2SA-5V.... Very frequently there are missing or lifted components(chips or small SOT) nearby of theses relays after reflow. Did someone faced to simmilar issue
Electronics Forum | Wed Jun 25 12:08:53 EDT 2003 | russ
I battle this all the time, I don't believe that it is the "gold corner" that is causing the problem but something with the PCB layer makeup (copper planes, or bottom side components, etc.). It could also be the nozzle you are using has a "hot spot/
Electronics Forum | Wed May 29 02:01:10 EDT 2024 | kumarb
No direct experience with these parts but to me, the air flow from top side fans are creating a wind tunnel that is causing the smaller parts to fly. Can you adjust the speed of these fans? Review the paste - review the component mount height. We fac
Electronics Forum | Wed May 29 07:41:33 EDT 2024 | tommy_magyar
We use the same component on many different products, never faced a similar issue. However, things I would check are: - stencil thickness (ideally 125um) - additional Z move on the parts around the relay (as suggested by kumarb) - check the packages
Electronics Forum | Fri Apr 23 08:20:25 EDT 2004 | babe
Sometimes solder balling is related to oxidized paste or paste that has sat on the pcb too long before reflow. Mostly it is related to process, sorry... Too slow or too fast of a reflow ramp rate. Heating up an assembly too quickly will not allow the
Electronics Forum | Thu Jan 12 13:18:07 EST 2012 | swag
215 to 220 deg.C peak reflow. We bake then store all PCB's in low humidity cabinets (appox. 3% RH) prior to running.
Electronics Forum | Mon Nov 24 11:19:21 EST 2008 | sjones
I am having problems soldering a Rohs compliant BGA ATMEL AT91RM9200(rohs compliant board) This device recommends a soldering profile from J-STD-20 and a minimum peak package temperature of 250 centigrade,peak 260. However a lot of the other componen
