Industry News | 2013-11-01 13:11:17.0
Indium Corporation's new SACM™ is a high-reliability solder alloy that offers drop shock performance far superior to other SAC alloys, without compromising on thermal cycling – all at a cost below that of typical SAC solder alloys.
Industry News | 2010-12-07 15:07:35.0
Christopher Associates announced today the introduction of Koki’s SB6N58-A730 Low Temperature Lead-Free Solder Paste. SB6N58-A730 paste has a melting point of 201-210°C. The paste also demonstrates extremely high thermal shock durability.
Industry News | 2014-10-08 11:30:43.0
Indium Corporation's Liyakathali Koorithodi, assistant technical manager, presented at IPC India on Sept. 24.
Industry News | 2010-03-17 18:31:55.0
EAST HANOVER, NJ – Zymet has introduced a new silica-filled reworkable board-level underfill encapsulant, X2825, whose coefficient of thermal expansion, CTE, is 26 ppm/°C. The underfill enhances drop and shock test reliability and, compared to higher CTE underfills, provides superior thermal cycle performance.
Industry News | 2013-11-05 22:51:20.0
Indium Corporation's Dr. Ning-Cheng Lee, Vice President of Technology, and Dr. Ron Lasky, Senior Technologist, will present at the SMTA/iNEMI Medical Electronics Symposium November 13-14 in Milpitas, California.
Industry News | 2014-05-07 10:51:17.0
Indium Corporation technology experts will present at the IPC Southeast Asia High Reliability Conference May 28 in Singapore.
Industry News | 2014-01-01 20:50:49.0
Enhanced-Reliability resistors are the preferred choice in applications where stable electrical and metallurgical parameters, performance and long field life are the primary considerations. In its continuing quests to satisfy its customers who have applications that demand these types of resistors, International Manufacturing Services, Inc. (IMS) is offering Enhanced-Reliability Resistors (EnRel). These MIL-STD 202 tested resistors are qualified for thermal shock in accordance to method 107 of the Mil STD 202 and 100% DC resistance tested according to method 303 of the MIL-STD 202.
Industry News | 2020-07-22 04:17:53.0
Indium Corporation earned Electronics Manufacturing (EM) World's Innovation Award for its low-temperature alloy technology, Durafuse™ LT. The award was presented on Friday, July 3, in Shanghai, China, during Productronica China.
Industry News | 2012-03-19 17:35:52.0
AIM announces that Karl Seelig, Vice President of Technology, will present at the upcoming International Conference on Soldering & Reliability
Industry News | 2022-07-16 08:39:50.0
SHENMAO America, Inc. is pleased to announce that the PF918-S Lead-Free BGA Sphere features the newly designed high-reliability alloy PF918 that can achieve tensile strength performance 1.4 times higher than the typical SAC305 alloy.
