Industry News | 2018-01-28 19:18:11.0
MIRTEC, “The Global Leader in Inspection Technology,” will premier its complete line of 3D AOI and SPI Inspection Systems in Booth #1327 at the 2018 IPC APEX EXPO. The premier technical conference and exhibition for the electronics manufacturing industry will take place February 27th- March 1st, 2018 at the San Diego Convention Center.
Industry News | 2020-06-30 15:07:32.0
MIRTEC is excited to announce its participation in an exclusive ONLINE CONFERENCE & EXPO. The event will be broadcast live on Wednesday, July 8, 2020 from 10 a.m. - 2:30 p.m. EST and will include a full program of live presentations, interviews and special guests.
Industry News | 2020-01-06 16:06:59.0
MIRTEC will premier its complete line of 3D AOI and SPI Inspection Systems in Booth #1900 at the 2020 IPC APEX EXPO. The premier technical conference and exhibition for the electronics manufacturing industry will take place Feb. 4-6, 2020 at the San Diego Convention Center.
Industry News | 2021-10-11 16:13:11.0
MIRTEC will showcase its cutting-edge INTELLI-PRO AI Based Smart Factory Automation Solution and GENSYS-PIN Automotive Pin Inspection System in booth #461, Hall A2 at the 2021 Productronica exhibition. The world's largest exhibition for the electronic manufacturing industry will take place on Nov. 16-19, 2021, at Messe Munich exhibition hall in Germany.
Industry News | 2010-09-30 00:35:51.0
The new E revisions of IPC’s popular desk reference manuals, IPC-DRM-PTH, Through-Hole Solder Joint Evaluation Training & Reference Guide and IPC-DRM-SMT, Surface Mount Solder Joint Evaluation Training & Reference Guide have been released.
Industry News | 2003-07-08 09:48:46.0
taking place September 28-October 2, at the Minneapolis Convention Center in Minneapolis, Minn.
Industry News | 2020-08-28 03:07:38.0
ITW EAE is proud to announce that it has earned two Vision Awards for innovative MPM and Electrovert technology developments. MPM received a Vision Award for a new paste monitoring system featuring temperature monitoring as well as upper and lower limit roll-height monitoring. Electrovert received a Vision Award for the new DwellFlex 4.0 variable contact wave solder nozzle. The awards were presented at NEPCON Asia.
Industry News | 2020-04-14 19:07:23.0
ITW EAE introduced the next-generation MPM® Momentum® II Printer with the release of the HiE and Elite models in November of 2019. Now the company is releasing the Momentum II BTB and Momentum II 100. The Momentum II BTB is a Back-to -Back configurable stencil printer that allows dual-lane processing for higher throughput without increasing either line length or capital investment.
Industry News | 2018-10-18 08:00:40.0
SMT solder joint quality and appearance inspection process
Industry News | 2018-10-18 08:01:00.0
SMT solder joint quality and appearance inspection process
