Electronics Forum | Thu Nov 15 09:29:29 EST 2012 | anvil1021
Maybe this piece of information will help. In China (just returned from visit) there are many factories that are using a dual temperature process using SAC305 or Sn100C and 42/58. Apparently this allows them to run their through hole parts through re
Electronics Forum | Fri Oct 01 01:27:58 EDT 2021 | sn
Hi Davef, thank you for your information.
Electronics Forum | Fri Oct 01 03:16:39 EDT 2021 | sn
thank you for your information.
Electronics Forum | Tue Aug 22 09:57:15 EDT 2006 | picman
I must prepare formal report abaut comparison of the SM988 and SAC 305 wave soldering( as a .ppt file). May you help me please ?
Electronics Forum | Thu May 13 20:40:25 EDT 2021 | winston_one
Yes, we can't use pure Pb PROCESS. And as I say we will not use it anyway, as we have lead-free BGA's, LGAs, component with Solder Charged Terminations... It's became almost normal practice to solder it with leaded solder pastes. In this case peak re
Electronics Forum | Fri Apr 01 09:40:57 EST 2005 | russ
Doug you are correct, I was talking about the integrety of the surface for mechanical measurement accuracy, not ESD properties.
Electronics Forum | Thu Oct 13 15:34:55 EDT 2005 | Amol
Hi, We are in the process of transitioning to LF production. What are some of board materials being successfully used in production? Also, what surface finishes show promice of good results with SAC 305 solder? We are currently testing multiple boar
Electronics Forum | Wed Dec 05 11:11:30 EST 2012 | eniac
SAC305 - it's just a metal composition of solder paste. All properties of solder paste depend on chemical composition of flux and other components - I don't know their names in English, sorry.
Electronics Forum | Tue Mar 14 05:02:35 EST 2000 | emmanuel
I am to implement PBGA, and i am looking for PCB surface finish informations. A lot of technical reports are specifing NiAu finishing because of flatness property. Because of leads shape, I though that BGA doesn't need flat pads like QFP. Is it false
Electronics Forum | Tue Mar 14 05:02:35 EST 2000 | emmanuel
I am to implement PBGA, and i am looking for PCB surface finish informations. A lot of technical reports are specifing NiAu finishing because of flatness property. Because of leads shape, I though that BGA doesn't need flat pads like QFP. Is it false
.png)
