Electronics Forum | Tue Mar 04 03:24:43 EST 2008 | reypal
I need some advise from those with experience on this component. We are facing soldering problem "pillow effect"(from cross section result)on this BGA. In the reflow profile point of view which area should we focused more? The soak time or the Total
Electronics Forum | Tue May 14 21:59:25 EDT 2013 | davef
SAC is a lead free solder alloy. At one time, Nippon Micrometal Corp. (NMC) [158-1, Sayamagahara, Iruma, 358-0032, Japan; +81.4.2934.6101 F+81.4.2934.5454 nmc-net.co.jp] called some of its alloys: LF35, LF45(SAC305), LF38(SAC105) and LF31(SAC405).
Electronics Forum | Wed Nov 08 10:48:34 EST 2023 | processman
Hi Was wondering what the general take is with reflow profiles to take into account differing solder paste alloy compared to the solder alloy used for the bumps of a bga device. For instance, SAC305 solder paste and BGA device with SAC105 (higher m
Electronics Forum | Mon Nov 13 18:36:32 EST 2023 | emeto
Your reflow profile should be designed towards the flux in your solder paste. To form a proper inter-metallic layer, you need to reach 20-30C above your melting point and stay in liquidus state for certain amount of time. SAC 105 has 3C difference fr
Electronics Forum | Mon Jan 10 16:58:48 EST 2011 | piter
Hi Ripal it seems that you have problem with compatibility of alloy and quality of solder balls. First check solder alloy form BGA balls what is it?(SAC105,SAC305, etc.) what type of solder paste you use?? third thing is what type of finishing you h
Electronics Forum | Wed Jul 01 13:17:39 EDT 2015 | davef
Cheryl Tulkoff and Randy Schueller do a good job summarizing the thinks on pad cratering here: http://www.smta.org/chapters/files/uppermidwest_padcratering.pdf Potential Mitigations to Pad Cratering * Board Redesign * Solder mask defined vs. non-s
Electronics Forum | Mon May 29 23:39:11 EDT 2006 | Faizal
Can anyone advice me on the effect of SN100C wave solder on SAC305 hasl board? I suppose the silver content on the hasl pcb would leech(contaminate) into solder pot.? Would it affect the surface bonding between copper pad and the solder.?
Electronics Forum | Wed Jan 17 08:27:38 EST 2007 | Bob R.
Is there a standard (IPC, JEDEC, JEITA, etc) covering the tolerances on percentages of Sn, Ag, and Cu in SAC305? I'd also be interested if there are standard allowable amounts of other contaminants. I couldn't turn up anything in a search of the IP
Electronics Forum | Tue Nov 24 10:43:06 EST 2009 | isd_jwendell
I have used SnBi from Alpha, and it worked well. The only issue I found is that you cannot have ANY Pb contamination.
Electronics Forum | Tue Oct 03 17:04:07 EDT 2006 | cuculi54986@yahoo.com
Glenn, What alloy are you using for Pb-free HASL? You say tin copper nickel, but is it SN100C? Against manufacturing engineering's recommendation, my company specified simply "Pb-free HASL" as the finish for our Pb-free PCBs. One of our suppliers
