Electronics Forum | Wed May 24 17:49:51 EDT 2000 | Keith Luke
SMTneters, The end of May finds several recent publications from leading publishers on my desk. I am all too happy to share these books with our loyal SMTneters in the hopes that they will provide us with a timely review of the new release. For ma
Electronics Forum | Fri Apr 17 15:06:57 EDT 1998 | Justin Medernach
| Hello Ya'll, | I've got what may be a silly question, but why does it seem so important to everybody that you have x-ray capability if you're thinking about doing BGA? | I know what most people will tell me; "Steve, that's a pretty silly qu
Electronics Forum | Tue Nov 06 10:28:58 EST 2018 | davef
Media Links IPC Global Insight This weekly electronic newsletter includes IPC news and multimedia information on manufacturing and management best practices and solutions, new technologies, standards, government relations and environment, health and
Electronics Forum | Tue Sep 16 23:58:03 EDT 2003 | iman
interesting! I recently invested a small personal fortune into books nad other related literature to boost my understanding the scientific properties of materials used in electronics and interconnection packages. One area( one of many areas) of p
Electronics Forum | Sat Aug 05 09:06:40 EDT 2000 | Dave F
I'm confused ... Land Grid Array (LGA). An alternative to the BGA for device manufacturers is to package their devices without any terminations on the bottom. Although not technically accurate, the easiest way to envision an LGA device is to pictu
Electronics Forum | Wed Jun 26 08:52:03 EDT 2002 | davef
There is no industry standard for reballing BGA. Search the fine SMTnet Archives for a reference to Motorola�s reasoning behind their not shipping product with reworked BGA. As background: * JEDEC is the semiconductor engineering standardization gr
Electronics Forum | Thu Jul 12 21:58:10 EDT 2007 | davef
Bill 1 Systems for BGA, Flip Chip, CSP and Bump measurement are: * UBM [550 Weddell Dr, Suite 3, Sunnyvale, CA 94089; 800-731-1220 f408-541-0153 contact@ubmusa.com ubmusa.com] ScanView, AutoScan and LaserScan. * Integrated Packaging Assembly; 2221 Ol
Electronics Forum | Mon Aug 27 15:06:29 EDT 2001 | davef
This otta push Wolfgang over the top ... Recommended reading G.G. Harman, Wire Bonding in Microelectronics : Materials, Processes, Reliability, and Yield, 2nd edition, McGraw-Hill Electronic Packaging and Interconnection Series, 1997. G.G. Harman, R
Electronics Forum | Tue Jan 30 21:15:51 EST 2001 | davef
You seem to pretty far from shore to begin thinking about boats and floatation devices. Most laser trimmers are used by: * Semiconductor fabricators * Resistive component fabricators * Hybrid circuit assemblers Component fabricators and hybrid [
Electronics Forum | Tue May 22 17:24:12 EDT 2001 | davef
What is your thinking on the issues surrounding design and manufacture with leadless leadframe [eg, land grid array, micropak] components beyond those in http://www.national.com/ads-cgi/viewer.pl/an/AN/AN-1187.pdf? The curve ball that we just looked
