Industry News | 2020-04-14 18:28:48.0
ITW EAE is introducing a patent pending option for the Camalot Prodigy dispenser that was developed to ensure process stability and increase yields for underfill applications. In applications where board heat is required, a constant product temperature through the dispense process is critical to ensure process stability and repeatability. Underfill materials vary in viscosity and filler types, therefore the heat requirement for the board also varies.
Industry News | 2023-09-20 14:28:04.0
Separating skip scored V-Scored PCB panels up to 48" long is made simple and easy with the K4000 PCB depanelizer from FKN Systek. Just place the bottom scoreline of the PCB onto the linear blade and step on a guarded foot switch to bring the circular blade across the top scoreline for clean separation of the PCB panels. Right and left blade guards assure operator safety. The front and back support and take up table are height adjustable.
Industry News | 2015-09-14 17:15:45.0
ISVI Corp. has announced the official release of its all-new IC-M29S-CL, a monochrome 29 Megapixel CCD camera with a base configuration Camera Link interface achieving 4.45fps.
Industry News | 2017-03-31 17:21:11.0
IPC – Association Connecting Electronics Industries®, is proud to announce the growing involvement of the Connected Factory Exchange (CFX). The 2-17 Connected Factory Initiative Subcommittee is comprised of representatives of the electronic industry’s leading manufacturers, machine, device, sensor and software companies.
Industry News | 2009-05-07 15:38:35.0
To be held in September 16-17, 2009, this symposium will focus on medical electronics and medical device applications. Abstracts due: May 29, 2009
Industry News | 2018-08-12 17:55:36.0
The SMTA is pleased to announce Ron Heberlein, Rockwell Collins, and Tony “Brick” Wilson, Lockheed Martin, will keynote SMTA International the morning of Tuesday, October 16 with their presentation “The World’s Most Advanced Fighter Jet Helmet – from Development and Production to the Fight.”
Industry News | 2014-11-25 17:04:36.0
During the 2014 Annual Meeting at SMTA International, the SMTA announced that Christine Taylor, a graduate student at Georgia Institute of Technology, has been selected as the recipient of the 2014 Charles Hutchins Educational Grant. The SMTA Grant Committee selected her project entitled "Nano- and Micro-scale Strain Sensors for Measuring Stress Evolution in Microelectronic Packages."
Industry News | 2015-04-07 15:57:40.0
SMTA and Chip Scale Review magazine are pleased to announce plans for the 12th Annual International Wafer-Level Packaging Conference and Tabletop Exhibition. This premier industry event explores leading-edge design, material, and process technologies being applied to Wafer-Level Packaging applications. There will be special emphasis on the numerous device and end product applications (RF/wireless, sensors, mixed technology, optoelectronics) that demand wafer level packaging solutions for integration, cost, and performance requirements.
Industry News | 2017-07-18 13:16:28.0
Depanelizing skip routed PCB panels up to 48" long is made simple and easy with FKN Systek’s K4000 PCB singulator. Just place the bottom scoreline of the PCB onto the linear blade and step on a guarded foot switch to bring the circular blade across the top scoreline for clean separation of the PCB panels. Right and left blade guards assure operator safety. The front and back support and take up table are height adjustable.
Industry News | 2009-10-16 16:10:36.0
User-Configurable Process Audit Tool
