Industry News: silver and sulfur (Page 3 of 9)

Indium Corporation Introduces Tabbing and Bus Ribbon Kits

Industry News | 2010-06-30 13:05:06.0

Indium Corporation has introduced their newly designed tabbing and bus ribbon kits . The kits, which contain common sized tabbing and bus ribbon and fluxes, are available in three versions, including one with a uniquely designed Pb-free, bismuth-containing, low-temperature coating.

Indium Corporation

New Low-Temperature Curing Conductive Adhesive Available for OLEDs and OPVs

Industry News | 2012-04-05 13:59:12.0

Engineered Conductive Materials introduces the low-temperature curing Conductive Adhesive DB-1541-LTC for use in organic light emitting diodes (OLED) and organic photovoltaics (OPV).

ECM Equipment Sales, Inc.

New High Thermal Conductivity LED Die Attach Adhesive for Small Die and LEDs from Engineered Material Systems

Industry News | 2013-09-05 20:26:22.0

Engineered Material Systems , a leading global supplier of electronic materials for circuit assembly applications debuts its CA-195 High Thermal Conductivity, Low Cost Electrically Conductive LED Die Attach Adhesive for attaching LED and other small semiconductor die to silver and copper lead frames.

Engineered Materials Systems, Inc.

Nihon Superior to Celebrate Its 50th Anniversary and Showcase New Developments at SMTAI

Industry News | 2015-08-26 18:25:32.0

Nihon Superior Co. will exhibit in Booth #419 at SMTA International, scheduled to take place Sep. 27 - Oct. 1, 2015 at the Donald Stephens Convention Center in Rosemont, IL. This year, Nihon Superior will celebrate its 50th anniversary since first introducing joining materials to the market. The most well-known solder; SN100C® has seen its 15th anniversary and its usage is still expanding. The reliability of SN100C has been proven in a wide range of electronics assembly products. The SN100C alloy delivers a silver-free stable microstructure that can accommodate the long-term and impact strains to which a solder joint can be subjected. The eutectic character of the SN100C alloy and the associated high fluidity provides faster wetting and increased spreadability over SAC305, which is beneficial in wave soldering and hand soldering applications as well as in reflow.

Nihon Superior Co., Ltd.

Christopher Associates and Koki Announce Patented S01X7C48-M500 High-Reliability Low-Ag Lead-Free Solder Paste

Industry News | 2011-01-26 20:33:39.0

Christopher Associates announced today the introduction of Koki’s S01X7C48-M500 High-Reliability Low-Ag Lead-Free Solder Paste. In response to the rise in the cost of metal, particularly silver, Koki has developed a lower cost alternative.

Christopher Associates Inc.

MacDermid Alpha Exhibits Capabilities and Latest Technology at Semicon Taiwan

Industry News | 2022-09-05 06:53:02.0

MacDermid Alpha Electronics Solutions will exhibit its total process solutions for the emerging semiconductor market at Semicon Taiwan, Taipei City, September 14-16, 2022 at Taipei Nangang Exhibition Center, Hall 1 (TaiNEX 1).

MacDermid Alpha Electronics Solutions

Engineered Material Systems Introduces Low-Cost Jettable Conductive Adhesive for Photovoltaic Stringing and Bussing Applications

Industry News | 2013-06-24 10:34:13.0

Engineered Material Systems (EMS), debuts its CA-148 Jettable Conductive Adhesive for ribbon stringing and bussing in photovoltaic applications.

Engineered Materials Systems, Inc.

SN100C Provides Faster Wetting and Increased Spreadability Over SAC305 – Visit Booth #1G08 at NEPCON South China

Industry News | 2017-08-10 17:43:56.0

Nihon Superior Co. announces its Nihon Superior Shanghai subsidiary will exhibit in Booth #1G08 at NEPCON South China, scheduled to take place August 29-31, 2017 at the Shenzhen Convention & Exhibition Center. The reliability of SN100C has been proven in a wide range of electronics assembly products. The eutectic character of the silver-free SN100C alloy and the associated high fluidity provides faster wetting and increased spreadability over SAC305.

Nihon Superior Co., Ltd.

Nihon Superior to Show Solder Pastes that Address Improvements in Reliability and Thermally Stable Joining

Industry News | 2017-01-10 08:37:14.0

Nihon Superior will exhibit in Booth #2610 at the 2017 IPC APEX EXPO, scheduled to take place Feb. 14-16, 2017 at the San Diego Convention Center in Calif. The reliability of the company’s SN100C lead-free alloy has been proven in a wide range of electronics assembly products. The eutectic character of the silver-free SN100C alloy and the associated high fluidity provides faster wetting and increased spreadability over SAC305, which is beneficial in wave soldering and hand soldering applications as well as in reflow.

Nihon Superior Co., Ltd.


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