Electronics Forum: slimkic and problem (Page 3 of 63)

Imm Silver and Voiding

Electronics Forum | Mon Jun 26 23:33:20 EDT 2006 | KEN

We saw this condition over 3 years ago. It sometimes is called "champagne bubbles". The intemetalic formation is interrupted due to the micro voiding reducing mechanical strength. I discovered this on lead free test vehicles for a major computer

wave pallets and titanium

Electronics Forum | Wed Sep 12 17:09:11 EDT 2007 | allwave

HI John, I use wave fixtures with titanium inserts. So far I have not seen any problem with walls about 0.010" thickness and 0.120" tall (or deep depending how you see it)...The Titanium-composite interface is also very strong (as long as you have e

0402's and Gluing.............

Electronics Forum | Wed Feb 16 17:32:49 EST 2005 | russ

Public Beating? Yes,Yes indeed. So Duckmann how is this little problem coming along? Russ

Granite Surface and ESD

Electronics Forum | Tue Mar 29 20:11:12 EST 2005 | KEN

If the granite is a problem, how about using some "stati-cide" type of spray.

Immersion gold and BGAs

Electronics Forum | Fri Aug 26 14:15:16 EDT 2005 | David

Where could I find more information regarding the double sided reflow and flux problems with white tin?

lead free and tombstoning

Electronics Forum | Fri Feb 17 09:02:21 EST 2006 | russ

proper pad geometries, accurate placement, and good reflow profile. Are you having problems right now?

OSP and SIR

Electronics Forum | Wed Aug 21 19:22:44 EDT 2002 | stownsend

Splitting hairs is putting it mildly. I�m just trying to rule out all variables. It doesn�t appear that we have an SIR problem, but since the newest variable is OSP (blame the new guy for all the problems), I have to consider it. I�ve seen this befo

Lead Free and ICT

Electronics Forum | Tue May 09 14:49:57 EDT 2006 | Larry

Hey guys, Anybody having trouble with increased false contact issues in ICT after switching from lead to lead free? Our test guys keep trying to imply that the flux residues are a problem (we're using Alpha EF2202), but as the soldering process eng

QFN's and LGA's

Electronics Forum | Wed May 20 17:18:09 EDT 2009 | daxman

Just out of curiosity, how are you or anyone else determining a defect? Last I checked, IPC had no criteria yet for solder defects for QFN components. Has this changed? Biggest problems we see are voids which our x-ray shows a lot of. Our problems

SMT optimization and improvement

Electronics Forum | Wed May 31 22:17:24 EDT 2006 | EC

Hi Jack, I do not know what type of machine you are using and how old is your machine. But I have this problem before using Fuji machine. There are few things cause part throw.....placment speed, feeder, pick up tolerance, part dimension tolerance,


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