Electronics Forum: smt conditions (Page 3 of 18)

Assemby of flexible printed circuits

Electronics Forum | Mon May 21 10:25:16 EDT 2012 | swag

Ask for board fiducials if you're running arrays. Global fids on the panel do not work well. One handy product we use on flex is "Tacsil". Works well on SMT pallets as well as router operation. It's double sticky stuff that helps hold on to the P

Re: Controlled TempHumidity rooms

Electronics Forum | Wed Dec 09 14:36:26 EST 1998 | Earl Moon

| Hi, I know for sure that by controlling temp. and humidity | conditions in SMT assy lines room, one gets advantage in | screen printing, adhesive dispensing, and pick&place | machines mainteinance. Does any one have any advice on why | else is a c

Re: Controlled TempHumidity rooms

Electronics Forum | Wed Dec 09 15:54:05 EST 1998 | Dave F

| Hi, I know for sure that by controlling temp. and humidity | conditions in SMT assy lines room, one gets advantage in | screen printing, adhesive dispensing, and pick&place | machines mainteinance. Does any one have any advice on why | else is a c

PCB bake

Electronics Forum | Thu Jan 17 20:33:05 EST 2002 | ianchan

Hi, Can anyone help explain the benefits/disadvantages of bareboard pcb baking, as part of the pre-heat conditioning, before the bareboard pcb use in SMT production run? The pcb board is 200mm x 240mm panelized pcb board, and has 28 smaller pcb boa

SMT resistors

Electronics Forum | Tue Jun 06 17:27:19 EDT 2006 | russ

See IPC 610 for this. Section 9, there are a lot of conditions so I will not post here Russ

Re: Used equipment price estimates..?

Electronics Forum | Mon Aug 03 22:00:50 EDT 1998 | Dave F

| I have some potential unused SMT equipment which may be candidates for sale. Any input regarding the value or expected going rate would be appreciated. | CONDITION: | E - Excellent Condition | F - Fair Condition | G - Good Condition | Equipment Li

Accelerated testing to Service life conversion

Electronics Forum | Mon Aug 06 12:30:51 EDT 2001 | Brad R.

I am having some SMT assemblies undergoing thermal shock testing per MIL-STD-883, Method 1011, Test Condition B. I was wondering if anyone has a chart, equation, article, etc. that will give me an idea of the service life of the assembly after it su

Humidity of SMT component storage environment.

Electronics Forum | Mon Jan 22 20:14:52 EST 2001 | davef

Take note that contrary to popular belief, it is not acceptable to assume that the floor life clock will be temporarily stopped when components are put back in dry storage following exposure to ambient conditions exceeding one hour. ... why doesn�t

What does MSL 4 on a component package means?

Electronics Forum | Thu Jan 03 02:35:18 EST 2002 | ianccy

Hi, I am trying to write SOP about the baking requirement of some CSP and uBGA components, the label on the packing said its usable within 72 hours and follow the MSL 4 condition, what does the MSL means? is it Material Safety Level? Has anything to

What does MSL 4 on a component package means?

Electronics Forum | Thu Jan 03 02:36:04 EST 2002 | ianccy

Hi, I am trying to write SOP about the baking requirement of some CSP and uBGA components, the label on the packing said its usable within 72 hours and follow the MSL 4 condition, what does the MSL means? is it Material Safety Level? Has anything to


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