Electronics Forum | Wed Aug 01 08:58:02 EDT 2018 | 2219576
Please check the solder paste height near PCB edges, Please check board clamping during solder paste printing. Please check tooling support boards must be fixed during the printing process. try to set wiper cleaning frequency and fine tune for best
Electronics Forum | Wed Dec 28 06:37:27 EST 2016 | luciano
Dear Anshang38, I actually don't have a profiler in order to get a new profile. I adjusted the machine once a coulpe years ago and did all regular maintenance and cleaning and it kept working fine until some weeks ago. I've changed all the flux and
Electronics Forum | Tue Aug 14 08:09:32 EDT 2018 | buckcho
Try something drastic just for testing - turn off cleaning! Then check again the result. Trust me, you can be surprised.
Electronics Forum | Tue Aug 14 09:39:31 EDT 2018 | stephendo
Every place I have ever worked has taped off the gold fingers. Maybe not the first run but within a few runs.
Electronics Forum | Fri Jul 27 13:51:53 EDT 2018 | vlad_saviuk
Hi, have some question: during solder paste printing I'm faced with problems on the edge of the PCB - solder balls on gold pads. During analisys we checked everything - change squeegee preasure, different cleaning cycles, squeegee speed - no effect.
Electronics Forum | Fri Dec 30 11:31:32 EST 2016 | horchak
First profilers are expensive and you can use temperature dots for setting up a wave. You stick them to the top side of the board and they change color based on temp. Top side temp should be around 250f or 125c when it hits the fountain. If you spra
Electronics Forum | Mon Dec 26 14:04:42 EST 2016 | luciano
Hi all, I'm having some troubles while trying to set up a wave soldering machine that was working just fine until a few weeks ago. The wave soldering machine is quite basic chinese made. It's 2 meters long, has spray fluxing and a short preheating
Electronics Forum | Thu Dec 29 09:03:03 EST 2016 | sumote
I would cut a piece of cardboard to the same dimensions as your circuit card. Run that through the fluxer of your machine and pull it out before the pre-heater. Take a look at the cardboard and verify that flux has been sprayed on it. That board look
Electronics Forum | Tue Aug 14 13:54:57 EDT 2018 | etmpalletguy
Vlad, Reduce your aperture opening in the stencil, this will give the stencil a good seal around the specific area of concern. In a wave solder environment, solder balling top or bottom surfaces in a wave pallet is caused by excessive flux burning o
Electronics Forum | Wed Mar 23 05:17:23 EDT 2011 | arwankhoiruddin
Hi All. I want to know what is the IPC/JEDEC standard for solder paste printing defects. From the brochures of SPI Machines, the recognized defects are excessive, insufficient, misalignment, no solder, bridging, and solder shape error. What document
