Industry News: solder mask dam (Page 3 of 25)

Count On Tools Offers Glue Dispense Nozzles for Universal Instruments’ GDM Line

Industry News | 2010-11-24 13:31:13.0

Count On Tools Inc., a leading provider of precision components and SMT spare parts, announces that it now offers Glue Dispense Nozzles for the Universal Instruments GDM line of equipment.

Count On Tools, Inc.

Long-time IPC Volunteer, Doug Pauls Inducted into IPC Hall of Fame

Industry News | 2017-02-16 19:40:34.0

In recognition of his extraordinary contributions to IPC and the electronics industry, Doug Pauls, principal materials and process engineer, Rockwell Collins, was honored with the IPC Raymond E. Pritchard Hall of Fame Award. Presented at IPC APEX EXPO® on Tuesday, February 14 at the San Diego Convention Center, the IPC Hall of Fame Award represents IPC's highest level of volunteer recognition.

Association Connecting Electronics Industries (IPC)

IPC Releases Additional Test Coupons for the IPC-2221B Gerber Coupon Generator Test Coupons provide structural integrity verification based on current printed board design technology

Industry News | 2018-05-22 12:19:27.0

IPC – Association Connecting Electronics Industries® would like to announce the release of additional test coupons for the IPC-2221B Gerber Coupon Generator, an exclusive annual subscription service for IPC member companies. The IPC-2221B Gerber Coupon Generator subscription service is the only service providing new, industry approved test coupons addressing blind, buried, stacked and staggered via structures. The most commonly used coupons for product acceptance are “AB,” “AB/R” and “D” which were introduced in 2016.

Association Connecting Electronics Industries (IPC)

Jack Bramel Receives IPC Raymond E. Pritchard Hall of Fame Award

Industry News | 2010-04-11 22:42:40.0

BANNOCKBURN, Ill., USA — In recognition of extraordinary contributions to IPC and the electronic interconnect industry, countless hours of volunteer service on IPC standards development committees and exceptional lifetime achievement, Jack Bramel, Jack Bramel & Associates was awarded the 2009 IPC Raymond E. Pritchard Hall of Fame Award. Presented at IPC APEX EXPO™ in Las Vegas, the Hall of Fame Award represents IPC’s highest level of member recognition.

Association Connecting Electronics Industries (IPC)

From the Wild West to the IPC Hall of Fame

Industry News | 2012-02-28 14:26:18.0

Since the "wild west" days of a relatively young printed circuit board industry when rules and infrastructure were not yet well established, Dennis “Denny” Fritz has been actively involved in IPC activities to help add structure, strength and vision to the industry. Today, he was honored with the IPC Raymond E. Pritchard Hall of Fame Award for his dedication and service to IPC and the industry. Presented at IPC APEX EXPO® in San Diego, the Hall of Fame Award represents IPC's highest level of volunteer recognition.

Association Connecting Electronics Industries (IPC)

Douglas Pauls Elected to Chair IPC's Top Standards Development Leadership Committee

Industry News | 2012-03-07 19:35:54.0

IPC announces the election of Douglas Pauls, principal materials and process engineer, Rockwell Collins, to chair the IPC Technical Activities Executive Committee (TAEC) for a two-year term. Elected to the position by the chairs and co-chairs of all IPC standards groups, Pauls succeeds Mel Parrish of STI Electronics, Inc. who held the role for IPC’s top standards development oversight committee for the past two years.

Association Connecting Electronics Industries (IPC)

IPC TECHNOLOGY TRENDS STUDY REVEALS CHANGES IN STORE FOR PCB FABRICATORS AND SUPPLIERS

Industry News | 2012-04-27 19:20:10.0

PCB Technology Trends 2011, a new study published this week by IPC — Association Connecting Electronics Industries®, shows how the demands of miniaturization and high-speed technology are driving changes in printed circuit board (PCB) processes and materials.

Association Connecting Electronics Industries (IPC)

IPC RELEASES NEW REVISION OF SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD

Industry News | 2010-07-22 22:37:02.0

IPC — Association Connecting Electronics Industries® has released the B revision of IPC-7351, Generic Requirements for Surface Mount Design and Land Pattern Standard. The leading industry standard for surface mount land pattern design and layout, IPC-7351B provides designers and printed board fabricators with updated guidance on requirements of land pattern geometries used for the surface attachment of electronic components, as well as surface mount design recommendations for achieving the best possible solder joints.

Association Connecting Electronics Industries (IPC)

Updates to IPC-6012 and IPC-A-600 Released: Five Years of New Board Technologies and Processes Bring Significant Changes to Specifications.

Industry News | 2010-04-10 02:09:54.0

If a picture is worth a thousand words, the new H revision of IPC-A-600, Acceptability of Printed Boards, is a priceless work of art for fabricators and assemblers, particularly inspectors and product developers. IPC — Association Connecting Electronics Industries® announces the new releases of IPC-A-600H and its companion document the C revision of IPC-6012, Qualification and Performance Specification for Rigid Printed Boards.

Association Connecting Electronics Industries (IPC)

Electronics Industry Volunteers Honored for Contributions to Industry and IPC

Industry News | 2011-04-20 21:26:17.0

IPC — Association Connecting Electronics Industries® presented Special Recognition, Distinguished Committee Leadership and Committee Service awards and a Presidents Award at IPC APEX EXPO™, held April 10–14, in Las Vegas.

Association Connecting Electronics Industries (IPC)


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