Industry News | 2020-07-09 18:44:44.0
Austin American Technology today announced their newest machine sale to AVANT Technology. The Texas based engineering and manufacturing company purchased the popular X30-A Stencil Cleaner from the X30™ Vertical Format Batch Cleaning Systems line.
Industry News | 2023-08-29 07:11:55.0
Indium Corporation® will showcase selections from its portfolio of proven products for thermal management and power electronics applications at SEMICON Taiwan, September 6‒8, in Taipei. In addition, Senior Area Technical Manager Jason Chou will deliver a presentation, The Lead-Free Materials Evolution in Power Die-Attach Soldering Applications, on September 7.
Industry News | 2016-03-07 14:06:37.0
Market Leader AdoptSMT will showcase at SMT 2016 in Hall 7, Stand No. 7-100 an array of new innovative products. These products and the service AdoptSMT offers their customers make AdoptSMT’s slogan become true: We keep your production running. AdoptSMT covers the processes of PCB assembly, hand soldering and industrial identification.
Industry News | 2023-09-25 20:04:34.0
Indium Corporation® will proudly feature an array of innovative materials solutions for thermal management and advanced packaging applications at the IMAPS International Symposium on Microelectronics, October 3-4, in San Diego, California.
Industry News | 2011-05-10 20:02:11.0
Aqueous Technologies Corp. announces that it is co-hosting a one-day technical workshop with Zestron and Henkel. The event, "Why Clean Electronic Assemblies?," will take place on June 14 and June 16, 2011.
Industry News | 2009-05-20 19:48:38.0
In a move designed to further expand the company's market and sales leadership, Henkel Corporation has selected Mr. Jim Wise to direct the global sales effort for its electronics assembly business.
Industry News | 2018-02-01 20:18:01.0
Nordson MARCH introduces the MesoSPHERE™ Plasma System for very-high throughput processing of 3D and wafer-level packaging processes such as fan-in, fan-out, wafer-level, and panel-level -handling wafers up to 450mm and panels up to 480mm. The MesoSPHERE's new, patented W3 three-axis symmetrical plasma chamber ensures that all areas of the wafer are treated equally and uniformly. Tight control over all process parameters gives highly repeatable results.
Industry News | 2024-02-19 12:00:05.0
Indium Corporation® will feature selections from its portfolio of proven products for automotive and power electronics applications, including electric vehicle manufacturing, at APEC 2024, February 25‒29 in Long Beach, California.
Industry News | 2010-05-12 13:12:33.0
Delivering a robust alternative to high-temperature solder processes, Henkel has developed Hysol ECCOBOND CA3556HF, a silver-filled electrically conductive adhesive designed to offer fast cure at low temperature. The material is ideal for high-throughput production processes and applications that dictate high peel strength, such as the assembly of photovoltaic (PV) modules, automotive sensors and membrane switches that incorporate temperature-sensitive substrates.
Industry News | 2023-10-31 18:57:08.0
Austin American Technology (AAT) is proud to announce that it has been honored with a prestigious Mexico Technology Award in the category of Cleaning Equipment. The award recognizes AAT's cutting-edge X-30 4.0 Fully Automatic Stencil, PCB & Misprint Cleaner for its outstanding innovation and performance. The announcement was made during a ceremony held on Wednesday, Oct. 25, 2023 at the SMTA Guadalajara in Mexico.
