Electronics Forum: solder sphere (Page 3 of 14)

01005 components and reflow profiles

Electronics Forum | Mon Apr 09 20:55:46 EDT 2012 | action_101

I forgot to add that we are using a 3 mil stencil. It seems like to me that may be there isn't enough flux left when we reach liquidous?? About half of the solder spheres do melt and wet on each pad, but the top half of each solder joint is just the

WLCSP Assembly options

Electronics Forum | Tue Mar 16 18:11:54 EDT 2021 | grahamcooper22

I am wondering, I have an application for assembling a 0.4mm WLCSP to a pcb....the solder sphere size is 0.26mm...would you print paste in the normal printing process and then place the device and reflow...or would you use a fluxing station on the pi

reballing

Electronics Forum | Tue Jan 13 15:16:12 EST 2004 | drewhmi

A small benchtop system uses a mask, tooled for your part, to arrange the solder spheres onto the BGA, after it has had the excess solder heat-vacuumed off and a new layer of flux applied. The spheres are poured into the cavity, excess decanted off.

BGA opens

Electronics Forum | Mon Feb 12 01:09:49 EST 2007 | Wayne

I think the best way is to the following: - to use the low temp solder paste, or - asks semi-con use low temp solder sphere to make BGA

Need Solder Ball 95.5% Sn 4.0% Ag 0.5% Cu

Electronics Forum | Thu May 19 19:28:31 EDT 2011 | Rstadem

Try Easyspheres (Kester), or Q-Pearls (Qualitek), or Alpha. They all have solder spheres in that alloy.

Solder Paste Mis-print

Electronics Forum | Tue Oct 04 08:10:29 EDT 2016 | philc

We have a "Blundell Stencil Cleaner" screen washer here, and if boards are badly printed, we put them in the wash, then dry them off thoroughly and reprint them. There are small, insignificant signs of tiny solder spheres afterwards, but nowhere near

PCB finish

Electronics Forum | Fri Jan 28 13:49:48 EST 2022 | jseewald

That is correct. This looks like a board that was printed then wiped but not washed. Solder spheres left out on an unsolderable surface will just sit there like this or coalesce into solder balls. Nothing in the picture indicates an issue with the

BGA Reballing

Electronics Forum | Wed Dec 07 16:01:45 EST 2005 | JP

I am attempting to reball some PBGA's with no luck. The problem is getting the solder spheres to sit in the stencil apertures and removing excess spheres. I apply light amount of flux to pads of a BGA, align a stencil over a BGA, then pour solder s

BGA Reballing Machines

Electronics Forum | Mon Mar 21 21:34:07 EST 2005 | Steve

Don't know of anything really automated, Winslow Automation offers solder spheres on water soluble tape and a company called the Waveroom Plus in NH offers a machine reasonably priced but it is not automated. There are companies out there that offer

Kester paste problems

Electronics Forum | Tue May 22 20:27:34 EDT 2007 | davef

What are the area and aspect ratio of the apertures that clog? When you print, you should be able to fit at least 4 of the mean sized solder sphere across the width or diameter of your smallest apertures.


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