Industry News: solderability problems (Page 3 of 55)

Solder Paste Application Standard Available in Danish IPC-7527 Establishes Two Firsts for IPC

Industry News | 2012-12-13 13:23:38.0

IPC-7527, Krav til Tinpastatryk, is also the first standard ever developed that focuses on the application of one of the industry’s most basic infrastructure elements, solder paste.

Association Connecting Electronics Industries (IPC)

IPC Conference on Quality, Reliability and Acceptability for Electronics Manufacturing in Budapest Offers Critical Information

Industry News | 2010-12-03 21:35:04.0

Eastern Europe's growing electronics assembly industry faces new challenges, especially with the adoption of lead-free technology. To connect manufacturers with solutions to these challenges, IPC — Association Connecting Electronics Industries® is holding the IPC Conference on Quality, Reliability and Acceptability for Electronics Manufacturing in Budapest, Hungary, on 22–24 February 2011.

Association Connecting Electronics Industries (IPC)

IPC-7527 Establishes Two New Firsts for IPC

Industry News | 2012-08-08 17:44:58.0

IPC Recently released, IPC-7527 was the brainchild of Task Group Nordic (TGNordic), IPC’s volunteer standards development group in Scandinavia.

Association Connecting Electronics Industries (IPC)

FREE Soldering and Assembly Defects - Causes and Cures Webinar

Industry News | 2010-12-01 14:28:16.0

With hundreds of opportunities for problems to surface during the electronics manufacturing process, it is a credit to the manufacturing and engineering talent of the industry that planes fly, pacemakers keep hearts beating and phones are at the ready to provide Facebook updates or even make a call. To keep these dedicated professionals up-to-date on the latest causes and cures for assembly and solder defects, IPC and the U.K. National Physical Laboratory (NPL) have teamed up to sponsor a free webinar at 12:00 pm (noon) U.S. Central time on January 27, 2011 — a precursor to the hands-on, three-day Process Defects Clinic that will be held at IPC APEX EXPO in April.

Association Connecting Electronics Industries (IPC)

IPC Conference to “Clean Up” Reliability Problems

Industry News | 2013-10-28 16:31:54.0

IPC Conference on Solder and Reliability: Materials, Processes and Tests, November 13–14 in Costa Mesa, Calif.

Association Connecting Electronics Industries (IPC)

I.C.T Automated Optical Inspection (AOI) to Improve SMT Line Efficiency

Industry News | 2022-10-12 08:07:17.0

I.C.T Provide SMT Production Line solutions with Automated Optical Inspection (AOI) AOI is short for Automated Optical Inspection, which is widely used in the electronics industry to check the appearance of PCBA assembly at the back end of the circuit board assembly line. The basic principle of AOI is to judge whether the object to be tested meets the standard by comparing whether there is a large difference between the object to be tested and the standard image by using image technology. AOI emits a 4-color light source to the PCBA board, which is automatically scanned by an industrial camera for catastrophic failures, such as missing components or quality defects. Therefore, the quality of AOI depends on the image imaging ability, algorithm parsing ability and image discrimination technology. I.C.T AOI has done well in these aspects.

Dongguan Intercontinental Technology Co., Ltd.

Phil Zarrow to Present SMTA Capital Chapter Tutorial Program

Industry News | 2018-02-25 08:20:55.0

The SMTA Capital Chapter is pleased to announce that it will host a Chapter Tutorial Program on March 15 with Phil Zarrow of ITM consulting presenting “Understanding and Implementing Best Practices in Electronic Assembly Processes”. To RSVP, please click on the following link: https://www.smta.org/education/chapter_tutorials/chapter_tutorials.cfm#capital

Surface Mount Technology Association (SMTA)

International Wafer-Level Packaging Conference (IWLPC) Offers In-Depth Tutorials

Industry News | 2011-08-15 12:43:52.0

The SMTA and Chip Scale Review magazine are pleased to announce eight in-depth tutorials will be offered at IWLPC 2011. Tutorials are application-oriented and structured to combine field experience with scientific research to solve everyday problems.

Surface Mount Technology Association (SMTA)

IPC/JEDEC-9704A Takes the Stress Out of Strain Gage Testing

Industry News | 2012-05-23 14:18:26.0

Joint Industry Guideline Provides Best Practices for Measuring the Strain on Boards and Components During Manufacturing

Association Connecting Electronics Industries (IPC)

Guidelines for Design and Assembly Process Implementation for Bottom Termination Components Released by IPC

Industry News | 2011-05-03 22:50:52.0

Assemblers who have tried to resolve problems that stem from the rapidly growing array of advanced packages are getting some help from IPC with the newly released IPC-7093, Design and Assembly Process Implementation for Bottom Termination Components. This standard describes the critical design, assembly, inspection, repair, and reliability issues associated with bottom termination components (BTCs) whose external connections consist of metallized terminals that are an integral part of the component body.

Association Connecting Electronics Industries (IPC)


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