Electronics Forum: soldering and temperature and precision (Page 3 of 12)

Cleaning Machine and Chemistry

Electronics Forum | Mon Feb 19 11:36:39 EST 2001 | billschreiber

Hello Mark, I wish it were that simple so I could direct you to a particular manufacturer and stencil cleaner model. Unfortunately, there are several issues complicating the process of cleaning all these applications in one machine. First and fore

Re: Paste-in_hole and CTE

Electronics Forum | Fri Jul 28 14:34:13 EDT 2000 | Gary Simbulan

Belive it or not, these boards were run through a Centech batch mode Vapor Phase machine. Single stage top side IR preheat. Vapor temp 218 C. Solder paste is an SN62 RMA.The boards were FR4 8 layer w/ solder mask, fairly conventional as might be e

Time and temp in lead and lead-free reflow

Electronics Forum | Fri Aug 01 21:10:35 EDT 2008 | leo_dektec

You can keep only the 5th zone as the reflow zone. And lower the first two zones to keep a good ramping rate. Meanwhile,please note the ting temperature in software or control panel is not the exact temperature in your PCB, you'd better get a KIC or

paste Sn42/Bi58 and Lead Finish

Electronics Forum | Thu Nov 15 09:29:29 EST 2012 | anvil1021

Maybe this piece of information will help. In China (just returned from visit) there are many factories that are using a dual temperature process using SAC305 or Sn100C and 42/58. Apparently this allows them to run their through hole parts through re

Soldering robot and solder balls

Electronics Forum | Tue Jun 20 15:08:30 EDT 2017 | ranap121212

Hello I have the problem with selective soldering on the robot. Thin balls appear on the laminate. The tin sometimes shoots...? and then the balls are a few millimeters from the soldering point. I tried up or down with temperature, but it did not wor

Re: Intermetallics and reflow profile

Electronics Forum | Wed May 03 20:24:22 EDT 2000 | Dave F

MF: I know of nothing that addresses your question directly. Let me suggest: * Technical types at your solder supplier should be able to help. * "Effect Of Intermetallic Compounds On The Thermal Fatigue Of Surface Mount Solder Joints" PL Tu, et a

paste Sn42/Bi58 and Lead Finish

Electronics Forum | Tue Nov 06 22:37:35 EST 2012 | davef

Ryan ... "As for bismuth-based lead-free alloys, a lower melting temperature than that of tin-lead is offered together with a cost similar to that of tin [in the area of $3/lb]. Unfortunately, bismuth in soldering alloys tends to create embrittlemen

Re: Reflow glue and past.

Electronics Forum | Tue Feb 08 16:09:09 EST 2000 | dean

Generally speaking with most electronic grade epoxies: 1. Cure time is a function of temperature. 2. Polymer bonds begin to quickly break down above certain temperatures (product specific). I believe aprox 170-180C. The strength of the bond de

Solder Splash/Balls and Flux Splash/Balls

Electronics Forum | Wed Dec 09 18:51:06 EST 2020 | johndep7

My company has been having issues with a lot of solder balls, solder splash, and flux balls all over a specific board. Now this is one of the only companies that require us not to clean our boards after our work is finished but this is also causing a

Leaded and Lead-Free Wave Parameters

Electronics Forum | Thu May 22 14:44:10 EDT 2008 | samir

Does your top-side preheat NEED to be that high, and so high that you are exceeding the flux manufacturers' spec? If so, what is the reason? Top-side wetting? Are you measuring this temperature at the substrate or solder joint?


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