Technical Library | 2019-07-17 17:56:34.0
The increased demand for electronic devices in recent years has led to an extensive research in the field to meet the requirements of the industry. Electrolytic copper has been an important technology in the fabrication of PCBs and semiconductors. Aqueous sulfuric acid baths are explored for filling or building up with copper structures like blind micro vias (BMV), trenches, through holes (TH), and pillar bumps. As circuit miniaturization continues, developing a process that simultaneously fills vias and plates TH with various sizes and aspect ratios, while minimizing the surface copper thickness is critical. Filling BMV and plating TH at the same time, presents great difficulties for the PCB manufactures. The conventional copper plating processes that provide good via fill and leveling of the deposit tend to worsen the throwing power (TP) of the electroplating bath. TP is defined as the ratio of the deposit copper thickness in the center of the through hole to its thickness at the surface. In this paper an optimization of recently developed innovative, one step acid copper plating technology for filling vias with a minimal surface thickness and plating through holes is presented.
Technical Library | 2021-04-08 00:30:49.0
As the electronic industry moves to lead-free assembly and finer-pitch circuits, widely used printed wiring board (PWB) finish, SnPb HASL, has been replaced with lead-free and coplanar PWB finishes such as OSP, ImAg, ENIG, and ImSn. While SnPb HASL offers excellent corrosion protection of the underlying copper due to its thick coating and inherent corrosion resistance, the lead-free board finishes provide reduced corrosion protection to the underlying copper due to their very thin coating. For ImAg, the coating material itself can also corrode in more aggressive environments. This is an issue for products deployed in environments with high levels of sulfur containing pollutants encountered in the current global market. In those corrosive environments, creep corrosion has been observed and led to product failures in very short service life (1-5 years). Creep corrosion failures within one year of product deployment have also been reported. This has prompted an industry-wide effort to understand creep corrosion
Industry News | 2021-02-18 15:54:21.0
Vishay Beyschlag Precision Automotive Grade Thin Film Chip Resistor Arrays are enhanced with Higher Resistance Ratios up to 1:100 and Operating Voltages up to 100V
Industry News | 2020-11-24 00:27:11.0
Research on non-precious metal catalysts. Research progress of non-precious metal catalysts for proton exchange membrane fuel cells
Electronics Forum | Mon Jun 25 03:52:24 EDT 2012 | awtm
Our Customer had detected tarnished pad on ImAg PCBA and had conducted several SEM-EDX test at the soldermask below some of the chip resistors. High concentration of sulfur was found and it can be significantly reduced after further chemical cleaned
Electronics Forum | Mon Jun 25 11:33:20 EDT 2012 | davef
The immersion silver is an active surface and readily combines with sulfur from the environment. Silver sulfide tarnishes the surface and creates doubt about the integrity of the finish at inspection. [uyemura.com/library-4.htm] Your customer's boar
Electronics Forum | Wed Nov 29 20:54:32 EST 2017 | truthseeker
DAVEF: In "Soldermask - sulfur presence" [http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=16291&#Message66659], how did you determined that sulfur was coming out of mats onto boards?
Electronics Forum | Mon Feb 26 09:36:08 EST 2001 | blnorman
ASTM E 443 is a test for sulfur by Oxygen Flask Combustion. Other instruments will detect sulfur (I assume a SEM with EDS capability will pick up the sulfur). We had an addition cure silicone potting compound inhibition problem last year that was t
Electronics Forum | Wed Sep 03 11:42:21 EDT 2008 | robinj
If the tarnish is really dark, it is very difficult to remove. Since it is yellowish it is only in the early stages. Replating will definitely work. I have used sulfuric acid based cleaners to remove this yellowish color. But rinse well and dry quick
Electronics Forum | Wed Feb 21 19:55:12 EST 2001 | davef
References on corrosion are: * "ASM Corrosion Handbook No. 13" [0871700077]. * "Electronic Packaging and Corrosion" ME Nicholson [0871702916]. Please explain how you determined that you have silver-sulfide contamination. Where is the silver comin
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