Electronics Forum | Thu Apr 26 16:43:16 EDT 2007 | Upper Management
Seminars and meetings are the best way to get a clear understanding of a machine's capabilities. I have found that the manufacturing engineers will oftentimes skew the results of machine evaluations with facts and data. In practice, I've found it
Electronics Forum | Thu Apr 26 09:03:35 EDT 2007 | ck_the_flip
3d is good for initial verification that your screen printer and stencil is producing the desired paste height. 2D verification is more than sufficient during regular production. That being said, your best bet for a 3D machine is to go cheap - buy
Electronics Forum | Thu Apr 26 10:07:06 EDT 2007 | realchunks
Hi Dub J, I have worked for a few companies that did 3D sampling and found the data they produce to be useless. In the real world they are slow, so that means you won't sample every board. Now if you're not sampling every board, and you start to r
Electronics Forum | Thu Apr 26 19:06:08 EDT 2007 | grayman
In short this guys are not well updated on the new technology of SPI. True, 3D IN LINE SPI is no longer a slow machine. Try checking some brand like Cyberoptics,Synapse imaging,SEIMENS,KOHYOUNG and many others...they can match the speed os some mount
Electronics Forum | Fri Jun 05 15:06:26 EDT 1998 | Dave F
| I have just been assigned to look into the ionic chromotograhy test on our PCBA but I have zero knowledge. Could anyone help to explain what is this test about? Is it | a) a destructive test? | b) What is the measurement unit of this test? | c) Wh
Electronics Forum | Tue Jun 08 22:30:05 EDT 2021 | vtdivtecs
So I am having a little trouble with my mydata MY19. its an older machine picked up used and its had its quirks. recently we tried to start adding electrical verification to our workflow, and had to disable it as we were getting intermittent bad pa
Electronics Forum | Wed Jul 04 12:22:07 EDT 2001 | davef
Several points: * Consider that your Cpk is probably different for both placing large and small components. * Probably your routine placement rate SB the speed you use to monitor the accuracy of your process. * Some people use a calibrated glass test
Electronics Forum | Wed Jan 04 12:48:34 EST 2006 | pjc
In-Circuit Test is the best method for ensuring solder joint connections. It is a much more reliable than AOI. An ICT machine can ensure solder connections are made for array package devices such as BGA, PGA, etc... AOI is best for component I.D.- is
Electronics Forum | Mon Feb 26 12:26:43 EST 2001 | CAM
I'm working a problem and looking for your input. Here the deal: Two sided mix technology board. Test is using unmasked via points on bottom for test points. Our fab drawing states tent via points on top side. First set of board came in with no tenti
Electronics Forum | Mon Oct 25 17:50:46 EDT 2004 | Mike
I work for a PCB Manufacture and I am looking for info on BGA Pull test or strenght test. I have a CM that is experiencing bga's with some weak joints. they are telling me that when they do their pull test the joints are breaking at the nickel inste
