Electronics Forum | Thu Jun 10 14:52:55 EDT 1999 | Earl Moon
| Hello all! | Recently we got a problem about the Funtional test. Some boards passed tests by using the auto-fixture(vacuum), but failed by using manual test fixture(need to plug CPU, DIMM etc.). The error symptom is no picture. We doubt it's the pr
Electronics Forum | Mon Jun 07 10:57:31 EDT 1999 | Dave F
| | | | Where I can find some informations about repairing of SMT boards? | | | | | | | | Thanks | | | | | | | | Marcos | | | | | | | A first place to start is IPC's 7711 and 7721 encompasing repair, modification, and rework procedures. | | | |
Electronics Forum | Fri Aug 29 09:39:08 EDT 2014 | rgduval
I'll try to deal with the issues as you've presented them. 1. Blistering/delamination, shown in photo 2. The most likely cause of blistering/delamination like this is moisture in the boards. The moisture can get into the boards in multiple ways..
Electronics Forum | Wed Jun 22 09:12:57 EDT 2005 | bsudak
Our manufacturing site has been struggling with soldering Alloy 42 TSOPs. Currently, we have to hand solder in one of our applications. Here are the particulars. Component: 54 leads, Sn plated, 400microinches +/-200. Process: Eutectic 63/37 Sn/Pb
Electronics Forum | Wed Jan 28 08:56:40 EST 2009 | blnorman
Don't know the specifics from the IPC spec. However our standard internal spec dictates - highest thermal mass, lowest thermal, most critical component, and center of PCB on the laminate surface. Our profilers have 6 inputs, so the other 2 are dete
Electronics Forum | Fri Feb 28 09:08:03 EST 2003 | davef
Without drilling through the numbers, they're probably correct. Recognize that standard warp / twist specs [IPC-A-610 1.5% for PTH only and 0.75% for SMT] are not going to make it on tech boards. You need to define specific requirements. This warp
Electronics Forum | Tue Mar 02 02:46:36 EST 2021 | Jessie Gao
If there is a way to ensure that the product is reliable, it is to ensure the predictability of its PCB, which is an important part of the product. In fact, PCB is the core component in almost all electronic products (from phones to computer systems)
Electronics Forum | Tue Jun 01 07:26:55 EDT 2004 | johnwnz
Alistair, your paste deposit is controlled by a few things: Stencil thickness Squeegee pressure Squeegee speed Print gap in 99 out of 100 applications for paste printing you would have a print gap of 0 i.e. on contact printing where the PCB is in fu
Electronics Forum | Sat Jan 23 13:29:40 EST 1999 | Earl Moon
| Hi Everyone, | We plan to build, for reliability/experimental/research purpose some CSPs (namely Tessera microBGA 46-I/O 0/75mm pitch and TI 64 I/O 0/8 mm pitch). the various factors that we plan to evaluate are the reliability and assembly concern
Electronics Forum | Fri Dec 16 18:37:10 EST 2005 | mdemos1
Hi. I am trying to understand Tg and how it relates to reflow. With the higher temperatures of lead free, we have been looking toward laminates with a Tg of 180 instead of the current 140. My question is a little more general. In either lead free
