Electronics Forum | Tue Jun 03 12:49:29 EDT 2008 | operator
If only my company would pay for a membership to IPC......
Electronics Forum | Wed Jun 04 00:13:18 EDT 2008 | operator
Very informative article. Thanks Dave.
Electronics Forum | Thu Aug 18 20:10:06 EDT 2016 | souldierann
Hi SweetOldBob, how did you say then?
Electronics Forum | Mon Mar 12 13:57:50 EDT 2007 | davef
That your problem is not related to component solderability or wave process related makes us believe this has to do with bare board design. Look at how your designer did the thermal relief on the two pins that don't solder well. If you can't get a
Electronics Forum | Tue Aug 05 17:19:55 EDT 2003 | csimfgeng
Another variable is whether the ground pads have proper thermal reliefs. If the pad has solid ground plane around the perimeter, the heat being applied will quickly dissipate to the surrounding metal. A proper relief of the pad will prevent the hea
Electronics Forum | Wed Jan 28 20:58:16 EST 2004 | davef
Vinny: From a thermal standpoint, your choices are: * Get your customer to design thermal relief in the board. * Set your thermal recipe to assure that the grounded pad reaches reflow temperature. This may require a long soak at a single temperature
Electronics Forum | Thu May 09 17:19:28 EDT 2002 | davef
Can�t help you with the article that you read. Other places to start are: * 2221, 7.2 Heat Dissipation Considerations, 7.3 Heat Transfer Techniques, and 8.1.10 Heat Dissipation * 2222, 9.1.2 Thermal Relief In Conductor Planes
Electronics Forum | Fri Jul 13 12:27:30 EDT 2007 | jseagle
As in more dwell? We see the same problem with through holes connected to power or ground planes. The solder reaches the plane and stops. We are having our boards re-designed to increase the thermal relief and expand the hole size. We are also tr
Electronics Forum | Tue Jun 03 22:54:54 EDT 2008 | davef
This might be a good starting point for you: http://pcdandf.com/cms/content/view/3760/95/
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