Electronics Forum | Fri Jan 04 09:44:59 EST 2008 | philkaz
Hello, I am Philip Kazmierowicz and I work with KIC, a Thermal Profiling company. We have done many lifetime experiments on Printed Circuit Boards over the years. The key thing to understand is that if the primary material of the board in FR4 fiber
Electronics Forum | Wed Jan 03 12:33:37 EST 2001 | Terry Burnette
John, There is one process issue that occurs with the larger BGA packages which have coplanarity near the high end of the .2mm spec.. The defect is commonly referred to as "ball in cup" and "head in pillow". It is an open solder connection whereby th
Electronics Forum | Mon Jun 19 04:42:37 EDT 2006 | Loco
There are plenty of studies on this subject. If the BGA can handle the extra temperature and they are soldered on a leadfree profile, the general result seems to be a better reliability than Pb :) Just out of the top of my head, there was a link to
Electronics Forum | Fri Nov 16 08:22:03 EST 2007 | ck_the_flip
For those of you who've completely switched to Pb-Free or who're running in a mixed environment, are you also buying or specifying the "RoHS PCBs" - the ones with * Greater Tg (glass transition temperature) * Thru-holes with limited drill hits and
Electronics Forum | Mon Apr 15 10:32:23 EDT 2019 | slthomas
Just a comment on the Heller 1500. We had 3 at a previous workplace where we never made the Pb-free transition (this was early 2000's). The ovens we had were not designed for and were never used for Pb-free processing yet every one of them had all o
Electronics Forum | Tue Aug 01 09:42:07 EDT 2000 | Gary
The Technical Services Group at Alpha Metals has spent a fair amount of time looking at wave soldered Pb-free connections. We too have observed fillet tearing, fillet lifting, and pad lifting. I have concluded that without major changes in the mate
Electronics Forum | Tue Oct 17 12:15:19 EDT 2000 | NLykus
Dave, Current process is Insert through hole components topside Dispense SMT glue Place SMT components bottom side Glue cure Insert 1 through hole component by hand Wave Wave temperature is 480oF Topside preheats in D.O.E ranged from 99oc to 108oC
Electronics Forum | Mon Feb 06 10:12:30 EST 2006 | Yash Sutariya
Hi, I authored the presentation so I may be able to help you out with your Q's. 1. IPC is in draft stage for 4 new material specs. These are in the presentation. I would focus on IPC 4101/ 121 and /124. Match your current Tg requirement to the T
Electronics Forum | Wed Nov 01 07:32:33 EST 2006 | davef
What you have run up against is the unfortunate consequence of the transition period from Sn-Pb to Pb-free. In the past 2-3 years there have been several studies highlighting the differences in reliability between mixed metal systems, Sn/Pb, and SAC
Electronics Forum | Fri Feb 25 02:30:32 EST 2011 | pkannan
Dstadem, Thanks for bringing your in valuable experience with the J STD 005 " Requirements of Solder Paste". I fully agree with you that the Solder Paste can be qualified for shelf life by doing simple viscosity test and visual inspection for coal
