Industry News | 2020-11-24 00:27:11.0
Research on non-precious metal catalysts. Research progress of non-precious metal catalysts for proton exchange membrane fuel cells
Industry News | 2014-07-28 13:56:52.0
240°C and novel stress absorbing capabilities to allow long-term reliability of large area flip-chip devices.
Industry News | 2012-02-15 19:12:30.0
Engineered Material Systems has released its new DA-5045-2 and DA-5045-4 High Thermal Conductivity Die Attach Adhesives for attaching light emitting diodes (LEDs) and small die.
Industry News | 2012-11-05 14:21:13.0
ECD is digging deep to find the oldest M.O.L.E.® so scour your plant for a vintage, working M.O.L.E.® thermal profiler and enter our contest to Win a New SuperM.O.L.E.® Gold 2 Kit
Industry News | 2013-06-24 10:34:13.0
Engineered Material Systems (EMS), debuts its CA-148 Jettable Conductive Adhesive for ribbon stringing and bussing in photovoltaic applications.
Industry News | 2013-10-22 14:45:08.0
Engineered Material Systems debuts its CA-165 Low-Cost Conductive Adhesive designed for chip-on-board or general die attach applications in circuit assembly, photonics or camera modules.
Industry News | 2014-01-07 18:42:22.0
Engineered Material Systems debuts its CA-175 Low Cost, Snap Cure Conductive Adhesive designed for lead-frame die attach applications in semiconductors, circuit assembly, photonics or camera modules.
Industry News | 2014-02-18 10:31:01.0
Isola Group S.à r.l. announced today that GETEK® laminates and prepegs are now in production at its facility in Düren, Germany, which will shorten lead times to Isola's European customers.
Industry News | 2014-05-05 16:29:24.0
Engineered Material Systems, Inc. (EMS) introduces the DF-4017 Dry Film Negative Photoresist for use in micro-electromechanical systems (MEMS).
Industry News | 2017-04-22 11:52:53.0
Engineered Material Systems is pleased to introduce the DF-4014 dry-film negative photoresist for use in micro-electro mechanical systems (MEMS), wafer-level packaging and CMOS applications (TSV sealing). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.
