Electronics Forum | Mon Aug 25 10:36:05 EDT 2008 | davef
Yes, it's peculiar that the layout of this board is so disorganized * Pads are not round, uniform, or the same size * Exposed traces have different thickness
Electronics Forum | Wed Aug 27 00:20:38 EDT 2008 | rameshr
Dear davef, Will u pls advice what are all the possible defects caused while soldering ( assembling ) this type of boards.
Electronics Forum | Wed Aug 27 08:25:24 EDT 2008 | davef
We'd expect to see: * Solder starved connections at pads with large trace/pad areas. * Less reliable solder connections at pads that do not match the shape and size of the corresponding pads on the component.
Electronics Forum | Fri Apr 09 08:58:28 EDT 1999 | Justin Medernach
| I'm not sure about limits but perhaps underfilling the BGA might easy your mind. Treat the BGA as something similar to a flip chip and dispense underfill around the part. The rigidity gained by the cured underfill may be enough to alleviate some
Electronics Forum | Tue Oct 17 18:27:21 EDT 2000 | Philip Reyes
Hello fellows, Can you clear me up regarding the reballing of Plastic BGA? Is it necessary to reball plastic BGA module if you have missing ball defect? What is the alternative process for rework? Do i need to flip the module then apply paste on
Electronics Forum | Mon Nov 16 08:50:04 EST 1998 | Larry Johnson
I don't really no much of any problems other then, be sure that the BGA avoids moisture. If the BGA has moisture inside of it when it across the wave. Due to the heat, the moisture will evaporate and cause shorts inside the BGA. Now if someone can
Electronics Forum | Sun Nov 15 23:40:59 EST 1998 | emori
Our design team is trying to change QFP into BGA. Does anyone have experience wavesoldering PCB with 0.5" pitch BGA's on the top side? What kind of problem will occure? Any advice is appreciated.
Electronics Forum | Wed Aug 09 18:31:11 EDT 2000 | Doug Teeter
Can anyone tell me the cost or estimated cost of soldering BGA's to the PCB (per package, per ball)?? Also, is there a similar cost for Rework
Electronics Forum | Thu Mar 29 15:50:35 EST 2001 | tomgervascio
We've think that with seen solder shorts under BGAs after wave soldering the boards. In addition, it seems to be related to a certain soldermask configuration over the topside BGA vias.. THere is one vendor,A, that is applying soldermask after HASL,
Electronics Forum | Tue May 27 10:34:30 EDT 2003 | davef
Much of the ability to survive rework or thermal excursions is dependent upon the fabrication materials. The board qualification criteria under the 55110 was designed around 5 thermal heat cycles. Consider reworking a BGA in this context. BGA i
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