Full Site - : wedge bonding (Page 3 of 7)

Saline Lectronics Announces New In-house Wire Bonding Capability

Industry News | 2015-08-11 09:37:25.0

Saline Lectronics now offers wire bonding in-house as an added-value service. With the installation of the Kulicke & Soffa 4500 Manual Wedge Bonder, Saline Lectronics is now one of the only electronic contract manufacturers in the Midwest to support wire bonding services. 

Saline Lectronics, Inc

Hesse & Knipps Appoints Prospect Technical Sales as Rep throughout Northwest United States and Canada

Industry News | 2012-08-02 11:15:11.0

Hesse & Knipps, Inc., (www.hesse-knipps.com) has strengthened its customer support and wedge bonder representation throughout Northwestern United States and Canada with the appointment of Prospect Technical Sales that will now support the company’s family of wedge bonders in Nevada, Oregon, Washington, Montana, Utah, Colorado, Northern California as well as the Canadian provinces of British Columbia and Alberta.

Hesse Mechatronics

MVP 850 DWMS

MVP 850 DWMS

New Equipment | Inspection

The 850 DWMS (Die Wire Metrology System) provides a range of advanced optic and handling solutions including 3D, high-resolution imaging and quad color lighting to provide the maximum defect, and measurement capabilities for Lead-Frame, Die and Wire-

Machine Vision Products, Inc

Ultrasonic Engineering   Al Wedge Wire Bonder

Ultrasonic Engineering Al Wedge Wire Bonder

New Equipment |  

Spec. : Al wedge wire bonder, Fine wire 25 to 50 micron meter diameter, Rotation head, 60kHz Ultrasonic, Bonding area 104x104 mm Remarks : Manual

Tanaka Corporation

850G Die Placement AOI

850G Die Placement AOI

New Equipment | Inspection

Microelectronics and Semiconductor Inspection. MVP's 850G provides the highest accuracy flip-chip, die assembly inspection. Ensuring the correct placement of the die on the substrate, while providing edge, FM and surface inspection. The 850G modu

Machine Vision Products, Inc

Inspection Innovations at SEMICON Taiwan 2022

Industry News | 2022-08-14 14:16:58.0

Test Research, Inc. (TRI) will join SEMICON Taiwan held at Taipei Nangang Exhibition Center, Hall 1 – 4F from September 14 - 16, 2022. Visit booth #M1034 to experience the latest in Smart Factory Semiconductor Inspection.

TRI - Test Research, Inc. USA

Bondjet BJ931 - High Speed Fully Automatic Dual-Head Wedge Bonder

Bondjet BJ931 - High Speed Fully Automatic Dual-Head Wedge Bonder

New Equipment | IC Packaging

The Bondjet BJ931 High Speed Fully Automatic Dual-Head Wedge Bonder meets the latest technology and flexibility demands for automotive and power electronics applications, handling thin and heavy aluminum, copper and gold wire and ribbon on two specia

Hesse Mechatronics

Hesse Mechatronics Appoints Representative for South America

Industry News | 2014-01-24 16:21:17.0

Hesse Mechatronics has appointed HTMG as the company's sales representative for South America.

Hesse Mechatronics

New Dual-Head Wedge Bonder Makes Americas Debut

Industry News | 2013-06-07 14:37:14.0

Hesse Mechatronics will introduce and demonstrate the new Bondjet BJ931L in booth 6081 in the North Hall at SEMICON West, taking place July 9-11 in San Francisco.

Hesse Mechatronics

Hesse & Knipps Appoints CWI Technical Sales as Rep for East Coast United States and Eastern Canada

Industry News | 2012-08-14 10:24:59.0

Hesse & Knipps, Inc., (www.hesse-knipps.com) has appointed CWI Technical Sales as its representative along the United States East Coast (states of CT, MA, RI, VT, ME, NH, NY, NJ, DE, MD, PA, WV, VA, NC, SC, GA and FL) as well as the Canadian provinces of Quebec and Ontario

Hesse Mechatronics


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