Electronics Forum | Thu Aug 15 09:02:04 EDT 2002 | davef
The fine SMTnet Archives have a couple of threads on double side reflow. Bob Willis Technical, Director, SMART Group, produced a Charity Report on the specific process of Double Sided Reflow Assembly. You can get the report from the SMTA [ http://w
Electronics Forum | Mon Aug 19 20:45:31 EDT 2002 | davef
Bob Willis and Phil Zarrow have had a running commentary on the ability of reflowed solder to hold components on the bottom side during reflow. You can find references to their component weight to pad area rations in the fine SMTnet Archives. The
Electronics Forum | Tue Jan 22 18:53:37 EST 2002 | barry
Hi all, or anyone. We recently purchased some smd equip. to do our own inhouse assy. Though we did purchase a training package it was short and sweet. What I was wonderin is their any tips on oven profiling, we were told that 90% of our product would
Electronics Forum | Mon Jan 28 07:40:40 EST 2002 | cnotebaert
Yes and Yes, Your solder supplier should recomend a profile (standard profile) in most cases you can follow it. Of course you should be running a thermal profile of each board type to verify it is within the specified temp rang. You should also chec
Electronics Forum | Tue Oct 01 16:18:16 EDT 2002 | davef
Q1: Is this [paste in hole] feasible? A1: Yes, many people lower their operating cost by reflowing through hole components. Q2: What types of components are difficult to do this way [paste in hole]? A2: Types of through hole components that are d
Electronics Forum | Wed May 15 12:55:11 EDT 2002 | fmonette
Hi Dave, The short answer is "not any significant amount" of moisture is removed during reflow. The temperature excursion is much too short. If you look at the physics of moisture diffusion inside a package you will see that only the surface moist
Electronics Forum | Tue May 14 21:07:03 EDT 2002 | ianchan
Hi mates, Yes, the lighter mass is a valid reasoning. in addition to the "lighter (mass) than thou" point of view, 1) the first reason for mounting active Parts (eg. IC, QFP, LGA...) is to minimize the temperature exposure of the Parts to a single
Electronics Forum | Wed Jan 30 06:08:09 EST 2002 | nifhail
Can someone pls help to explain what is the vapour phase reflow soldering technology ? Thx, nifhail
Electronics Forum | Wed Jan 30 12:37:49 EST 2002 | jax
nifhail, In a nutshell: Vapor-phase reflow is a process that uses a fluid with a selected boiling point. As condensation of the hot vapor occurs on a cool assembly the assembly's temperature is rapidly raised to match the temperature of the vapor.
Electronics Forum | Fri Feb 01 10:57:52 EST 2002 | davef
Yes, that's what people are thinking. The 217�C melting temperature that you mention requires a ~250�C reflow temperature. Generally, boards, legend ink, and components cannot take that temperature. Further, few ovens can produce that temperature
