New Equipment | Cleaning Equipment
Plasma Cleaner Low pressure plasma cleaner system can modify all kinds of printing or adhesive substrates prior to surface activation, modification, grafting, roughening or cleaning. Application: LCM, IC Packaging (Flip Chip, CSP, BGA, Lead F
The BT-1 Plasma Etch System is fully automated and is capable of processing large quantities of parts up to 21"x21" for substrate cleaning and surface modification applications prior to bonding applications. VISIT THE PLASMA ETCH WEBSITE FOR MORE IN
Industry News | 2019-04-01 19:37:06.0
Nordson MARCH announces the introduction of its FlexTRAK®-SHS automated plasma treatment system. The plasma system includes the 9.6-liter (585 in³) large-volume F3-S process chamber that can be configured for larger strips or can treat more strips per cycle, yielding higher throughput and increased productivity for semiconductor and electronics packaging.
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New Equipment | Cleaning Equipment
Fast removal of residual photoresist on the wafer, the wafer surface to clean, etch rates with the highest industry. Apllication: ．Surface cleaning and modification for LCD, IC Packaging (Flip Chip, CSP, BGA, Lead Frame, etc.), LED Packaging,
Gold / Aluminum / Copper Bonding Wires The bonding wires is the most important material used in making electrical connections between the chip and the external circuit. It has good conductivity and corrosion resistance, and it could be used for extr
Tianjin Advanced Electronics Co., Ltd. is one Hi-Tech company. Special in semiconductor material and brazing. Provide fine bonding wire, including COB(chip on board) Al Si1% and pure gold wire. Advanced manufacturing technology and equipment .Whole
Used SMT Equipment | Semiconductor & Solar
Nordson MARCH AP-300 Plasma System Cleaner 100-230VAC, 50/60Hz, 3.5A @208V, Single Phase A compact and benchtop model, the Nordson March plasma system AP-300 has a volume capacity of 33.1 liters, supported by up to seven (7) adjustable shelves in
New Equipment | Surface Finish
Designed for wafer processing, Nordson MARCH's SPHERE™ series plasma systems, the StratoSPHERE offers superior plasma treatment for high-throughput advanced semiconductor packaging applications. The StratoSPHERE plasma system is ideal for wafer pro
PLASMATREAT: Openair Plasma Process, Eliminating all Organic and Silicon-Based Contaminants Effectively Removes Electrostatically Attached Dust Applicable to Flat Surfaces as well as Complex 3D Shapes Atmospheric Plasma Process Reduces O
The Bondjet BJ931 High Speed Fully Automatic Dual-Head Wedge Bonder meets the latest technology and flexibility demands for automotive and power electronics applications, handling thin and heavy aluminum, copper and gold wire and ribbon on two specia
